Specifications
SKU: 108110
CMOS Bus Arbiter
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | Vcc | 4.5 | 5.0 | 5.5 | V | |
Standby Current | Icc | Vcc = 5V, No Load | - | 10 | 30 | μA |
Operating Current | Icc | Vcc = 5V, Full Load | 50 | 100 | 150 | mA |
Input Voltage Range | Vin | 0 | - | Vcc | V | |
Output Voltage Range | Vout | 0 | - | Vcc | V | |
Maximum Output Current | Iout | Per Channel | - | - | 50 | mA |
Maximum Power Dissipation | Pd | - | - | 625 | mW | |
Operating Temperature | Topr | -40 | - | 85 | °C | |
Storage Temperature | Tstg | -65 | - | 150 | °C |
Instructions for Use
Power Supply:
- Connect the Vcc pin to a stable 5V power supply.
- Ensure the power supply can provide the required operating current (up to 150mA).
Input Connections:
- Connect input signals to the appropriate input pins within the voltage range of 0V to Vcc.
Output Connections:
- Connect load devices to the output pins, ensuring the current drawn does not exceed 50mA per channel.
- Verify that the output voltage is within the specified range of 0V to Vcc.
Thermal Management:
- Ensure adequate heat dissipation if the device is operated at high power levels or in high ambient temperatures.
- The maximum power dissipation is 625mW, so avoid exceeding this limit to prevent thermal damage.
Temperature Considerations:
- Operate the device within the temperature range of -40°C to 85°C for optimal performance.
- Store the device in an environment with temperatures between -65°C and 150°C.
Standby Mode:
- To minimize power consumption, use the standby mode where the current draw is reduced to 10-30μA.
- Ensure all inputs and outputs are properly configured to avoid unintended operation during standby.
Electrostatic Discharge (ESD) Protection:
- Handle the device with care to avoid ESD damage.
- Use proper grounding and ESD protection measures during handling and assembly.
Soldering:
- Use a soldering iron with a temperature not exceeding 300°C.
- Ensure the soldering process is completed quickly to avoid thermal stress on the device.
Testing:
- After assembly, test the device under normal operating conditions to ensure all parameters are within specifications.
- Perform functional tests to verify correct operation of all channels.
Inquiry - CP82C89