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Specifications
SKU: 116985
Hex Inverter
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | Operating | 4.5 | 5.0 | 5.5 | V |
| Input Voltage | Vin | Low Level | 0 | - | 0.8 | V |
| Vin | High Level | 2.0 | - | Vcc | V | |
| Output Voltage | Vout | Low Level | 0 | - | 0.4 | V |
| Vout | High Level | 2.4 | - | Vcc-0.5 | V | |
| Input Current | Iin | Low Level | -1 | - | 1 | mA |
| Iin | High Level | -1 | - | 1 | mA | |
| Output Current | Iout | Low Level | -10 | - | - | mA |
| Iout | High Level | - | - | 10 | mA | |
| Propagation Delay Time | tpd | Low to High | 25 | 35 | 45 | ns |
| tpd | High to Low | 25 | 35 | 45 | ns | |
| Power Dissipation | Pd | Maximum | - | - | 100 | mW |
| Operating Temperature | Toper | Commercial Grade | 0 | - | 70 | °C |
| Storage Temperature | Tstg | -55 | - | 150 | °C |
Instructions for Use
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V.
- Connect the ground (GND) pin to a stable reference point.
Input Signals:
- For a low-level input, ensure the voltage is between 0V and 0.8V.
- For a high-level input, ensure the voltage is between 2.0V and Vcc.
- The input current should not exceed ±1mA.
Output Signals:
- For a low-level output, the voltage will be between 0V and 0.4V.
- For a high-level output, the voltage will be between 2.4V and Vcc - 0.5V.
- The output current should not exceed ±10mA.
Propagation Delay:
- The propagation delay time (tpd) from input to output is typically 35ns, with a minimum of 25ns and a maximum of 45ns.
Power Dissipation:
- Ensure that the power dissipation does not exceed 100mW to avoid overheating and potential damage.
Temperature:
- The operating temperature range is 0°C to 70°C for commercial grade devices.
- The storage temperature range is -55°C to 150°C.
Handling:
- Handle the HD7416P with care to avoid static discharge, which can damage the device.
- Use proper anti-static precautions when handling and storing the device.
Mounting:
- Ensure proper soldering techniques are used to avoid thermal stress on the device.
- Follow the recommended PCB layout guidelines for optimal performance and reliability.
By following these parameters and instructions, you can ensure the reliable operation of the HD7416P in your application.
(For reference only)Inquiry - HD7416P
