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UPD70320L8

Specifications

SKU: 149368

BUY UPD70320L8 https://www.utsource.net/itm/p/149368.html
V25TM 16/8-BIT SINGLE-CHIP MICROCONTROLLER
Parameter Description Value Unit
Supply Voltage (VCC) Operating supply voltage 4.5 to 5.5 V
Standby Current (ISB) Current consumption in standby mode 10 μA
Active Current (IACT) Current consumption in active mode 20 mA
Output Voltage (VOH) High-level output voltage 2.4 to 5.0 V
Output Voltage (VOL) Low-level output voltage 0 to 0.4 V
Input Voltage (VIH) High-level input voltage 2.0 to 5.5 V
Input Voltage (VIL) Low-level input voltage 0 to 0.8 V
Operating Temperature (Toper) Operating temperature range -40 to +85 °C
Storage Temperature (Tstg) Storage temperature range -65 to +150 °C
Maximum Junction Temperature (Tjmax) Maximum junction temperature 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 4.5 to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Current Consumption:

    • In standby mode, the device consumes approximately 10 μA.
    • In active mode, the current consumption can reach up to 20 mA.
  3. Output Levels:

    • The high-level output voltage (VOH) should be between 2.4V and 5.0V.
    • The low-level output voltage (VOL) should be between 0V and 0.4V.
  4. Input Levels:

    • The high-level input voltage (VIH) should be between 2.0V and 5.5V.
    • The low-level input voltage (VIL) should be between 0V and 0.8V.
  5. Temperature Considerations:

    • The operating temperature range is from -40°C to +85°C.
    • The storage temperature range is from -65°C to +150°C.
    • The maximum junction temperature (Tjmax) should not exceed 150°C.
  6. Handling and Storage:

    • Store the device in a dry environment to prevent moisture damage.
    • Handle the device with care to avoid static discharge, which can damage sensitive components.
  7. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure reliable connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  8. Testing:

    • Test the device under typical operating conditions to ensure it meets the specified performance parameters.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

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