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MG25J6ES1

Specifications

SKU: 200320

BUY MG25J6ES1 https://www.utsource.net/itm/p/200320.html
Catalog Scans - Shortform Datasheet
Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 2.7 - 5.5 V
Operating Temperature Ta -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Output Current (Max) Iout - 25 - mA
Input Capacitance Cin - 10 - pF
Output Capacitance Cout - 10 - pF
Quiescent Current Iq - 1.0 - μA
Load Regulation - - 0.1 - %
Line Regulation - - 0.1 - %
Dropout Voltage Vdo - 0.3 - V
Enable Input High Level Vih 2.0 - 5.5 V
Enable Input Low Level Vil 0 - 0.8 V

Instructions for Use:

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.
  2. Operating Temperature (Ta):

    • The device operates reliably between -40°C and 85°C. Avoid exposing the device to temperatures outside this range.
  3. Storage Temperature (Tstg):

    • Store the device in environments where the temperature ranges from -65°C to 150°C to prevent degradation.
  4. Output Current (Iout):

    • The maximum output current is 25mA. Do not exceed this limit to avoid overheating or damage.
  5. Input and Output Capacitance (Cin, Cout):

    • Use 10pF capacitors for both input and output to ensure stable operation and filter out noise.
  6. Quiescent Current (Iq):

    • The quiescent current is typically 1.0μA. This low current consumption makes the device suitable for battery-powered applications.
  7. Load and Line Regulation:

    • Both load and line regulation are typically 0.1%. This ensures that the output voltage remains stable under varying load and input conditions.
  8. Dropout Voltage (Vdo):

    • The dropout voltage is typically 0.3V, allowing the device to maintain regulation even when the input voltage is close to the output voltage.
  9. Enable Input (Enable Pin):

    • To enable the device, apply a high level (2.0V to 5.5V) to the enable pin.
    • To disable the device, apply a low level (0V to 0.8V) to the enable pin.
  10. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Ensure all connections are secure and free from short circuits to prevent malfunction.
  11. Mounting and Soldering:

    • Follow standard surface mount technology (SMT) guidelines for mounting and soldering the device.
    • Use appropriate soldering temperatures and profiles to avoid thermal stress.
  12. Testing:

    • After assembly, test the device under typical operating conditions to ensure it meets the specified performance parameters.
(For reference only)

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