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MC68030RP16B

Specifications

SKU: 207295

BUY MC68030RP16B https://www.utsource.net/itm/p/207295.html
Microcontroller/Microprocessor MCU/MPU
Parameter Symbol Min Typical Max Unit
Supply Voltage VCC 4.75 5.0 5.25 V
Core Voltage VCCINT 3.0 3.3 3.6 V
Operating Temperature Toperating -40 85 °C
Storage Temperature Tstorage -65 150 °C
Maximum Junction Temperature Tjmax 150 °C
Clock Frequency fCLK 40 50 MHz
Power Consumption (Active) Pactive 1.5 2.5 W
Power Consumption (Idle) Pidle 0.1 0.3 W
Static Current Istatic 10 20 μA
Dynamic Current Idynamic 100 300 mA
Output High Level VOH 2.4 3.5 5.0 V
Output Low Level VOL 0.0 0.4 0.5 V
Input High Level VIH 2.0 3.5 5.0 V
Input Low Level VIL 0.0 1.5 2.0 V
Rise Time tr 3.0 5.0 ns
Fall Time tf 3.0 5.0 ns

Instructions for Use

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the range of 4.75V to 5.25V.
    • The core voltage (VCCINT) should be between 3.0V and 3.6V.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 85°C.
    • Store the device in an environment with temperatures ranging from -65°C to 150°C.
    • Do not exceed the maximum junction temperature of 150°C.
  3. Clock Frequency:

    • The clock frequency can range from 40MHz to 50MHz for optimal performance.
  4. Power Consumption:

    • Active power consumption is typically around 1.5W but can go up to 2.5W.
    • Idle power consumption is typically around 0.1W but can go up to 0.3W.
  5. Current Requirements:

    • Static current is typically around 10μA but can go up to 20μA.
    • Dynamic current is typically around 100mA but can go up to 300mA.
  6. Signal Levels:

    • Ensure that output high levels (VOH) are between 2.4V and 5.0V.
    • Ensure that output low levels (VOL) are between 0.0V and 0.5V.
    • Input high levels (VIH) should be between 2.0V and 5.0V.
    • Input low levels (VIL) should be between 0.0V and 2.0V.
  7. Signal Timing:

    • Rise time (tr) is typically around 3.0ns but can go up to 5.0ns.
    • Fall time (tf) is typically around 3.0ns but can go up to 5.0ns.
  8. Handling Precautions:

    • Handle the device with care to avoid static discharge.
    • Ensure proper heat dissipation to prevent overheating.
  9. Mounting and Layout:

    • Follow recommended PCB layout guidelines to ensure reliable operation.
    • Use appropriate decoupling capacitors near the power pins to reduce noise.
  10. Testing and Validation:

    • Perform thorough testing under various operating conditions to validate performance and reliability.
(For reference only)

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