Specifications
SKU: 272517
HEXFET Power MOSFET
Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Drain-Source Voltage | VDS | - | 55 | - | V | |
Gate-Source Voltage | VGS | -10 | - | 20 | V | |
Continuous Drain Current | ID | - | 40 | - | A | TC = 25°C |
Continuous Drain Current | ID | - | 26 | - | A | TC = 75°C |
Pulse Drain Current | IDM | - | 80 | - | A | tp = 10 ms, Duty = 1% |
Gate Charge | QG | - | 120 | - | nC | VGS = 10V |
Input Capacitance | Ciss | - | 2900 | - | pF | VDS = 25V |
Output Capacitance | Coss | - | 750 | - | pF | VDS = 25V |
Reverse Transfer Capacitance | Crss | - | 500 | - | pF | VDS = 25V |
RDS(on) | RDS(on) | - | 4.5 | - | mΩ | VGS = 10V, ID = 20A, TC = 25°C |
RDS(on) | RDS(on) | - | 6.5 | - | mΩ | VGS = 10V, ID = 20A, TC = 75°C |
Total Power Dissipation | PTOT | - | 150 | - | W | TC = 25°C |
Junction Temperature | TJ | - | - | 175 | °C | |
Storage Temperature | TSTG | -55 | - | 150 | °C |
Instructions for Use:
Handling Precautions:
- Handle the device with care to avoid damage to the leads or the body.
- Use proper ESD (Electrostatic Discharge) protection when handling the device.
Mounting:
- Ensure that the device is mounted on a heatsink if operating at high power levels to maintain junction temperature within safe limits.
- Follow the recommended PCB layout guidelines to minimize parasitic inductances and ensure good thermal performance.
Biasing:
- Apply the gate-source voltage (VGS) carefully to avoid exceeding the maximum ratings.
- Use a gate resistor to limit the current during switching transitions and reduce ringing.
Operation:
- Do not exceed the maximum drain-source voltage (VDS) or continuous drain current (ID).
- Ensure that the device operates within its safe operating area (SOA) to prevent thermal runaway.
Testing:
- Test the device under controlled conditions to verify its performance and reliability.
- Use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury.
Storage:
- Store the device in a dry, cool place to prevent moisture absorption and degradation.
- Keep the device in its original packaging until ready for use to protect it from static discharge and physical damage.
Inquiry - IRF3707ZCS