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SAB8286AP

Specifications

SKU: 288309

BUY SAB8286AP https://www.utsource.net/itm/p/288309.html
Bus Controller for SAB 8086 Family Processors
Parameter Symbol Min Typ Max Unit Description
Supply Voltage Vcc 4.75 5 5.25 V Operating supply voltage range
Operating Temperature Toper -40 - 85 °C Range of ambient temperatures for operation
Storage Temperature Tstg -65 - 150 °C Range of temperatures for storage
Output Current per Pin Iout - 25 50 mA Maximum output current per pin
Total Output Current Itotal - 100 200 mA Maximum total output current
Power Dissipation Pd - 350 500 mW Maximum power dissipation (derated above +70°C)
Input Leakage Current Iin - 1 5 μA Maximum input leakage current
Output Leakage Current Ileak - 0.1 1 μA Maximum output leakage current
Propagation Delay Time tpd 10 20 30 ns Typical propagation delay time
High-Level Output Voltage Voh 3.5 4.5 5 V Output voltage at high level (Iout = 5mA)
Low-Level Output Voltage Vol 0 0.5 0.9 V Output voltage at low level (Iout = 10mA)

Instructions:

  1. Supply Voltage:

    • Ensure the supply voltage is within the specified range (4.75V to 5.25V) to avoid damage or malfunction.
  2. Temperature:

    • Operate the device within the operating temperature range (-40°C to 85°C) and store it within the storage temperature range (-65°C to 150°C).
  3. Current Handling:

    • Do not exceed the maximum output current per pin (50mA) or the total output current (200mA) to prevent overheating and potential damage.
  4. Power Dissipation:

    • The device can dissipate up to 500mW, but derate the power dissipation above +70°C to ensure reliable operation.
  5. Input and Output Leakage:

    • Account for the input and output leakage currents when designing circuits to avoid unexpected behavior.
  6. Propagation Delay:

    • Consider the propagation delay time (10ns to 30ns) when designing timing-sensitive applications.
  7. Output Voltage Levels:

    • Verify that the high-level output voltage (3.5V to 5V) and low-level output voltage (0V to 0.9V) meet the requirements of the connected circuit.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
  9. Mounting:

    • Follow recommended soldering and mounting procedures to ensure proper thermal management and mechanical stability.
(For reference only)

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