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MC145155P

Specifications

SKU: 303021

BUY MC145155P https://www.utsource.net/itm/p/303021.html
Parallel-Input PLL Frequency Synthesizer
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc 4.5 5.0 5.5 V
Operating Temperature Toper -40 85 °C
Storage Temperature Tstg -65 150 °C
Input Voltage Range Vin 0 Vcc V
Output Voltage High VOH Iout = -1 mA Vcc-0.5 Vcc-0.1 V
Output Voltage Low VOL Iout = 1 mA 0 0.5 V
Propagation Delay Time tpd Vcc = 5V, Tamb = 25°C 25 45 ns
Power Consumption Pdiss Vcc = 5V, Tamb = 25°C 100 mW

Instructions for Use

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the specified range of 4.5V to 5.5V to avoid damage to the device.
  2. Operating Temperature (Toper):

    • The device is designed to operate within a temperature range of -40°C to 85°C. Avoid operating outside this range to prevent performance degradation or failure.
  3. Storage Temperature (Tstg):

    • Store the device in an environment with temperatures ranging from -65°C to 150°C to ensure long-term reliability.
  4. Input Voltage Range (Vin):

    • The input voltage should be between 0V and the supply voltage (Vcc). Exceeding these limits can cause damage to the device.
  5. Output Voltage High (VOH) and Low (VOL):

    • When sourcing current (Iout = -1 mA), the output voltage high (VOH) should be between Vcc-0.5V and Vcc-0.1V.
    • When sinking current (Iout = 1 mA), the output voltage low (VOL) should be between 0V and 0.5V.
  6. Propagation Delay Time (tpd):

    • The propagation delay time is the time it takes for the output to respond to a change in input. At a supply voltage of 5V and ambient temperature of 25°C, the typical propagation delay is 25 ns, with a maximum of 45 ns.
  7. Power Consumption (Pdiss):

    • The power consumption at a supply voltage of 5V and ambient temperature of 25°C is typically 100 mW. Ensure adequate heat dissipation if operating at higher power levels or in high-temperature environments.
  8. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Use proper grounding and ESD protection when handling the device.
  9. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure reliable connections without damaging the device.
    • Avoid excessive thermal stress during soldering.
  10. Testing:

    • Test the device under controlled conditions to verify its functionality before integrating it into a larger system.
(For reference only)

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