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FT245BM

Specifications

SKU: 322541

BUY FT245BM https://www.utsource.net/itm/p/322541.html
FT245BM USB FIFO USB - Parallel I.C.
Parameter Symbol Conditions Min Typical Max Unit
Operating Voltage Vcc 4.75 5.25 V
Input Current Iin 100 mA
Output Current (Per Pin) Iout 20 mA
Data Rate fD USB Full Speed 12 Mbps
Input Capacitance Cin 10 pF
Output Capacitance Cout 10 pF
Operating Temperature Toper Storage -40 85 °C
Storage Temperature Tstg -65 150 °C
Power Consumption Pwr Active 150 mW
Power Consumption Pwr Suspend 0.5 mW

Instructions for FT245BM

  1. Power Supply:

    • Ensure the supply voltage is within the range of 4.75V to 5.25V.
    • Use a stable power source to avoid voltage fluctuations.
  2. Data Transfer:

    • The FT245BM operates at USB Full Speed, which supports data rates up to 12 Mbps.
    • Ensure that the data lines are properly terminated to minimize signal reflections and improve data integrity.
  3. Input/Output Pins:

    • Each output pin can source up to 20 mA of current.
    • Each input pin has a capacitance of 10 pF, which should be considered when designing the circuit.
  4. Temperature Range:

    • The device is designed to operate between -40°C and 85°C.
    • For storage, the temperature range is -65°C to 150°C.
  5. Power Consumption:

    • In active mode, the device consumes approximately 150 mW.
    • In suspend mode, the power consumption drops to about 0.5 mW.
  6. Capacitance:

    • The input and output pins have a capacitance of 10 pF each. This should be accounted for in the design to ensure proper signal integrity.
  7. Schematic Design:

    • Place decoupling capacitors close to the Vcc and GND pins to filter out noise and provide stable power.
    • Use appropriate pull-up or pull-down resistors on control lines as needed.
  8. Programming:

    • Use the FTDI D2XX drivers or VCP (Virtual COM Port) drivers to interface with the FT245BM from your host application.
    • Refer to the FTDI documentation for detailed programming examples and API usage.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage the IC.
    • Follow ESD (Electrostatic Discharge) precautions during handling and assembly.
  10. Testing:

    • Before finalizing the design, test the FT245BM under various conditions to ensure reliable operation.
    • Verify the data transfer rate and signal integrity using an oscilloscope or logic analyzer.
(For reference only)

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