Specifications
SKU: 380066
Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Supply Voltage | VDD | 2.7 | - | 5.5 | V |
Operating Temperature | Toper | -40 | - | 85 | °C |
Storage Temperature | Tstg | -65 | - | 150 | °C |
Input Current | Iin | - | 100 | - | μA |
Output Current | Iout | - | 20 | - | mA |
Power Consumption | Pdiss | - | 100 | - | mW |
Response Time | tresp | - | 50 | - | ns |
Rise Time | tr | - | 10 | - | ns |
Fall Time | tf | - | 10 | - | ns |
Output Voltage (High) | VOH | - | VDD-0.1 | - | V |
Output Voltage (Low) | VOL | - | 0.1 | - | V |
Quiescent Current | IQ | - | 10 | - | μA |
Instructions for TDC2905KM
Supply Voltage:
- Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
- Use appropriate decoupling capacitors (0.1μF and 10μF) close to the power pins to stabilize the supply.
Operating Temperature:
- The device operates reliably between -40°C and 85°C.
- Store the device between -65°C and 150°C.
Input Current:
- The typical input current is 100μA. Ensure that the input signal source can provide this current.
Output Current:
- The typical output current is 20mA. Do not exceed this limit to avoid damage to the device.
Power Consumption:
- The typical power consumption is 100mW. Ensure adequate heat dissipation if operating near the maximum power.
Response Time:
- The typical response time is 50ns. This is the time it takes for the device to respond to changes in input.
Rise and Fall Time:
- The typical rise and fall times are both 10ns. These parameters define the speed at which the output transitions between high and low states.
Output Voltage Levels:
- The output voltage when high (VOH) is typically VDD - 0.1V.
- The output voltage when low (VOL) is typically 0.1V.
Quiescent Current:
- The typical quiescent current (IQ) is 10μA. This is the current consumed by the device when it is not actively driving a load.
Handling Precautions:
- Handle the device with care to avoid electrostatic discharge (ESD).
- Follow proper soldering techniques to prevent thermal stress on the device.
Layout Considerations:
- Place the device close to other components to minimize trace lengths and reduce noise.
- Use ground planes to improve signal integrity and reduce interference.
Testing:
- Before final assembly, test the device under typical operating conditions to ensure it meets performance specifications.
Inquiry - TDC2905KM