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TDC2905KM

Specifications

SKU: 380066

BUY TDC2905KM https://www.utsource.net/itm/p/380066.html

Parameter Symbol Min Typical Max Unit
Supply Voltage VDD 2.7 - 5.5 V
Operating Temperature Toper -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Input Current Iin - 100 - μA
Output Current Iout - 20 - mA
Power Consumption Pdiss - 100 - mW
Response Time tresp - 50 - ns
Rise Time tr - 10 - ns
Fall Time tf - 10 - ns
Output Voltage (High) VOH - VDD-0.1 - V
Output Voltage (Low) VOL - 0.1 - V
Quiescent Current IQ - 10 - μA

Instructions for TDC2905KM

  1. Supply Voltage:

    • Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
    • Use appropriate decoupling capacitors (0.1μF and 10μF) close to the power pins to stabilize the supply.
  2. Operating Temperature:

    • The device operates reliably between -40°C and 85°C.
    • Store the device between -65°C and 150°C.
  3. Input Current:

    • The typical input current is 100μA. Ensure that the input signal source can provide this current.
  4. Output Current:

    • The typical output current is 20mA. Do not exceed this limit to avoid damage to the device.
  5. Power Consumption:

    • The typical power consumption is 100mW. Ensure adequate heat dissipation if operating near the maximum power.
  6. Response Time:

    • The typical response time is 50ns. This is the time it takes for the device to respond to changes in input.
  7. Rise and Fall Time:

    • The typical rise and fall times are both 10ns. These parameters define the speed at which the output transitions between high and low states.
  8. Output Voltage Levels:

    • The output voltage when high (VOH) is typically VDD - 0.1V.
    • The output voltage when low (VOL) is typically 0.1V.
  9. Quiescent Current:

    • The typical quiescent current (IQ) is 10μA. This is the current consumed by the device when it is not actively driving a load.
  10. Handling Precautions:

    • Handle the device with care to avoid electrostatic discharge (ESD).
    • Follow proper soldering techniques to prevent thermal stress on the device.
  11. Layout Considerations:

    • Place the device close to other components to minimize trace lengths and reduce noise.
    • Use ground planes to improve signal integrity and reduce interference.
  12. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets performance specifications.
(For reference only)

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