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MTP27N10E

Specifications

SKU: 383378

BUY MTP27N10E https://www.utsource.net/itm/p/383378.html
LASER MODULE 635NM 4.2MW MVP
Parameter Symbol Min Typ Max Unit Description
Drain-Source Voltage VDS -10 - 100 V Maximum drain-to-source voltage
Gate-Source Voltage VGS -20 - 20 V Maximum gate-to-source voltage
Continuous Drain Current ID - - 27 A Maximum continuous drain current at 25°C
Pulse Drain Current IDM - - 54 A Maximum pulse drain current (t = 10 ms)
Power Dissipation PD - - 130 W Maximum power dissipation at 25°C
Junction Temperature TJ -55 - 150 °C Operating junction temperature range
Storage Temperature TSTG -65 - 150 °C Storage temperature range
Total Gate Charge QG - 70 - nC Total gate charge
Input Capacitance Ciss - 1300 - pF Input capacitance at VGS = 10V, VDS = 10V
Output Capacitance Coss - 280 - pF Output capacitance at VGS = 0V, VDS = 10V
Reverse Transfer Capacitance Crss - 200 - pF Reverse transfer capacitance at VGS = 0V, VDS = 10V
RDS(on) at VGS = 10V RDS(on) - 0.035 - Ω On-state resistance at VGS = 10V
RDS(on) at VGS = 4.5V RDS(on) - 0.055 - Ω On-state resistance at VGS = 4.5V
Threshold Voltage VGS(th) 2 4 6 V Gate threshold voltage

Instructions for Use:

  1. Operating Conditions:

    • Ensure that the drain-source voltage (VDS) does not exceed 100V.
    • The gate-source voltage (VGS) should be kept within ±20V.
    • The continuous drain current (ID) should not exceed 27A at 25°C ambient temperature.
    • For pulse conditions, the drain current (IDM) can reach up to 54A for a duration of 10 ms.
  2. Thermal Management:

    • The maximum power dissipation (PD) is 130W at 25°C. Proper heat sinking is required to manage power dissipation at higher temperatures.
    • The operating junction temperature (TJ) should be between -55°C and 150°C.
    • Store the device in a temperature range of -65°C to 150°C.
  3. Electrical Characteristics:

    • The on-state resistance (RDS(on)) is 0.035Ω at VGS = 10V and 0.055Ω at VGS = 4.5V.
    • The total gate charge (QG) is 70 nC.
    • Capacitances (Ciss, Coss, Crss) are provided for circuit design considerations.
  4. Handling and Storage:

    • Handle the device with care to avoid damage to the leads and body.
    • Store in a dry, cool place within the specified storage temperature range.
  5. Mounting:

    • Ensure proper mounting to a heatsink to maintain thermal performance.
    • Follow recommended soldering profiles to avoid thermal stress during assembly.
  6. Testing:

    • Test the device under controlled conditions to verify its parameters and performance.
    • Use appropriate test equipment and methods to measure electrical characteristics accurately.
(For reference only)

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