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HM6116ALP-3

Specifications

SKU: 426549

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x8SRAM
Parameter Description Value
Part Number Device Identifier HM6116ALP-3
Type Memory Type Static Random Access Memory (SRAM)
Organization Memory Organization 16K x 8 bits
Supply Voltage (Vcc) Operating Supply Voltage 5.0 V ± 5%
Operating Temperature Temperature Range -40°C to +85°C
Access Time (tAC) Access Time 15 ns
Cycle Time (tCYC) Cycle Time 25 ns
Data Hold Time (tDH) Data Hold Time 3 ns
Data Setup Time (tDS) Data Setup Time 10 ns
Power Consumption Active Power Consumption 300 mW (typical)
Standby Current Standby Current 10 μA (maximum)
Package Type Package 28-pin Plastic DIP
Pin Configuration Pin Count 28
Input Voltage (VIH) High-Level Input Voltage 2.0 V to Vcc
Input Voltage (VIL) Low-Level Input Voltage 0 V to 0.8 V
Output Voltage (VOH) High-Level Output Voltage Vcc - 0.5 V
Output Voltage (VOL) Low-Level Output Voltage 0.5 V
Write Enable (WE#) Write Enable Pin Active Low
Chip Enable (CE#) Chip Enable Pin Active Low
Output Enable (OE#) Output Enable Pin Active Low

Instructions for Use

  1. Power Supply:

    • Connect the Vcc pin to a 5.0 V ± 5% power supply.
    • Connect the GND pin to ground.
  2. Address Lines:

    • Connect the address lines (A0-A13) to the appropriate address signals from your system.
  3. Data Lines:

    • Connect the data lines (D0-D7) to the data bus of your system.
  4. Control Signals:

    • Write Enable (WE#): Set this pin low to write data to the memory.
    • Chip Enable (CE#): Set this pin low to enable the chip.
    • Output Enable (OE#): Set this pin low to read data from the memory.
  5. Timing Considerations:

    • Ensure that all timing parameters (access time, cycle time, setup and hold times) are met to avoid data corruption.
    • Use appropriate pull-up or pull-down resistors on control lines if necessary.
  6. Handling:

    • Handle the device with care to avoid static damage.
    • Store the device in an anti-static bag when not in use.
  7. Testing:

    • Verify the functionality of the device by writing and reading data to and from various memory locations.
    • Use a logic analyzer or oscilloscope to verify signal integrity and timing.
  8. Mounting:

    • Ensure proper alignment of the device during soldering to avoid damage to the pins.
    • Follow the recommended PCB layout guidelines for optimal performance.
(For reference only)

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