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M54532P

Specifications

SKU: 438104

BUY M54532P https://www.utsource.net/itm/p/438104.html
4-UNIT 1.5A DARLINGTON TRANSISTOR ARRAY WITH CLAMP DIODE
Parameter Symbol Min Typ Max Unit Description
Supply Voltage Vcc 4.5 5.0 5.5 V Operating supply voltage
Output Current Iout - 10 20 mA Maximum output current per channel
Operating Temperature Toper -40 - 85 °C Operating temperature range
Storage Temperature Tstg -65 - 150 °C Storage temperature range
Input Voltage (High) VIH 2.0 - Vcc V Minimum input voltage for high logic level
Input Voltage (Low) VIL 0 - 0.8 V Maximum input voltage for low logic level
Output Voltage (High) VOH 2.4 - Vcc-0.5 V Minimum output voltage for high logic level
Output Voltage (Low) VOL 0 - 0.5 V Maximum output voltage for low logic level
Propagation Delay Time tpd - 15 35 ns Typical propagation delay time
Power Dissipation PD - - 700 mW Maximum power dissipation per package

Instructions:

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Current (Iout):

    • The maximum output current per channel should not exceed 20mA to prevent overheating or damage.
  3. Operating Temperature (Toper):

    • The device is designed to operate within the temperature range of -40°C to 85°C. Avoid operating outside this range to ensure reliable performance.
  4. Storage Temperature (Tstg):

    • Store the device in an environment with temperatures between -65°C and 150°C to prevent physical damage.
  5. Input Voltage Levels:

    • For high logic level, the input voltage (VIH) should be at least 2.0V and can go up to the supply voltage (Vcc).
    • For low logic level, the input voltage (VIL) should be no more than 0.8V.
  6. Output Voltage Levels:

    • For high logic level, the output voltage (VOH) will be at least 2.4V and can go up to Vcc - 0.5V.
    • For low logic level, the output voltage (VOL) will be no more than 0.5V.
  7. Propagation Delay Time (tpd):

    • The typical propagation delay time is 15ns, with a maximum of 35ns. This is the time it takes for a change in input to affect the output.
  8. Power Dissipation (PD):

    • The maximum power dissipation per package is 700mW. Ensure proper heat dissipation to avoid overheating.
  9. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Use appropriate decoupling capacitors near the power supply pins to reduce noise and improve stability.
  10. Mounting and Soldering:

    • Follow standard surface mount technology (SMT) procedures for mounting and soldering the device.
    • Ensure the PCB layout provides adequate thermal paths to dissipate heat effectively.
(For reference only)

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