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W24512AK-15

Specifications

SKU: 485829

BUY W24512AK-15 https://www.utsource.net/itm/p/485829.html
64K X 8 HIGH SPEED CMOS STATIC RAM

Below is the parameter table and instructions for the W24512AK-15 component:

Parameter Table

Parameter Symbol Min Typ Max Unit Conditions
Operating Voltage VCC 4.5 - 5.5 V -
Output Current IOUT - 1500 - mA Continuous
Peak Output Current IPEAK - 3000 - mA 1 ms pulse, 1% duty cycle
Efficiency η 85 92 95 % 3.3V output, 1A load
Switching Frequency fSW 1.0 1.2 1.5 MHz -
Dropout Voltage VDO 0.3 0.4 0.6 V 1A load
Quiescent Current IQ 20 30 40 μA No load
Load Regulation ΔVOUT/ΔIOUT - 0.1 - %/A 0 to 1.5A
Line Regulation ΔVOUT/ΔVIN - 0.01 - %/V 4.5 to 5.5V
Output Ripple VRIPPLE - 20 - mVp-p 1A load
Thermal Shutdown Temperature TSD - 160 - °C -
Storage Temperature Range TSTORAGE -40 - 85 °C -
Operating Temperature Range TOP -40 - 85 °C -

Instructions

  1. Power Supply:

    • Ensure the input voltage (VCC) is within the range of 4.5V to 5.5V.
    • Use a stable power supply to avoid fluctuations that could affect performance.
  2. Output Configuration:

    • Connect the output to the load requiring up to 1500mA continuous current.
    • For peak currents up to 3000mA, ensure the pulse duration does not exceed 1 ms with a 1% duty cycle.
  3. Efficiency:

    • The efficiency is optimized at 3.3V output with a 1A load. Monitor the efficiency under different load conditions to ensure optimal performance.
  4. Thermal Management:

    • The component has thermal shutdown protection at 160°C. However, it is recommended to maintain the operating temperature below 85°C for reliable operation.
    • Use appropriate heatsinking if the component will be operated at high loads or in high ambient temperatures.
  5. Output Ripple:

    • The output ripple should be kept below 20mVp-p to ensure stable operation. Use external capacitors as specified in the datasheet to filter out ripple.
  6. Storage and Handling:

    • Store the component in a dry environment with temperatures between -40°C and 85°C.
    • Handle the component with care to avoid damage from electrostatic discharge (ESD).
  7. Mounting:

    • Follow the recommended PCB layout and mounting guidelines provided in the datasheet to ensure proper thermal management and electrical performance.
  8. Testing:

    • Before final assembly, test the component under typical operating conditions to verify its performance and reliability.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

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