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TLP621GB

Specifications

SKU: 501173

BUY TLP621GB https://www.utsource.net/itm/p/501173.html
Optocoupler DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP
Parameter Symbol Conditions Min Typ Max Unit
Forward Voltage VF IF = 10 mA 1.1 1.3 1.5 V
Reverse Breakdown Voltage VBR IR = 1 mA - 500 - V
Output Current (Isolated Side) IC(max) Ta = 25°C - 150 - mA
Isolation Voltage VIORM 1 min, 50/60 Hz - 2500 - Vrms
Turn-On Time ton IF = 10 mA, RL = 100 Ω, VCC = 5 V - 3 - μs
Turn-Off Time toff IF = 10 mA, RL = 100 Ω, VCC = 5 V - 5 - μs
Storage Temperature Range TSTG - -40 - 85 °C
Operating Temperature Range TA - -40 - 105 °C

Instructions for Use:

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the specified range to avoid damage to the device.
    • Use a stable power supply to minimize noise and interference.
  2. Forward Current:

    • The forward current (IF) should not exceed the maximum rating to prevent overheating and potential failure.
    • Use a current-limiting resistor if necessary to control the forward current.
  3. Reverse Voltage:

    • Do not apply a reverse voltage greater than the specified breakdown voltage (VBR) to avoid damage to the phototransistor.
  4. Output Current:

    • The output current (IC) on the isolated side should not exceed the maximum rating to ensure reliable operation and prevent damage.
  5. Isolation Voltage:

    • The isolation voltage (VIORM) must be respected to maintain electrical isolation between the input and output sides. Exceeding this value can lead to breakdown and loss of isolation.
  6. Timing Parameters:

    • Consider the turn-on (ton) and turn-off (toff) times when designing circuits to ensure proper timing and avoid glitches.
  7. Temperature Considerations:

    • Operate the device within the specified storage (TSTG) and operating (TA) temperature ranges to ensure reliable performance and longevity.
    • Avoid exposing the device to extreme temperatures or rapid temperature changes.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to prevent thermal shock and mechanical stress.
  9. Mounting:

    • Ensure proper mounting and alignment to avoid mechanical stress on the leads.
    • Use appropriate heat sinks if necessary to manage thermal dissipation.
  10. Testing:

    • Test the device under controlled conditions to verify its performance and functionality before integrating it into the final application.
(For reference only)

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