Specifications
SKU: 501173
Optocoupler DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Forward Voltage | VF | IF = 10 mA | 1.1 | 1.3 | 1.5 | V |
Reverse Breakdown Voltage | VBR | IR = 1 mA | - | 500 | - | V |
Output Current (Isolated Side) | IC(max) | Ta = 25°C | - | 150 | - | mA |
Isolation Voltage | VIORM | 1 min, 50/60 Hz | - | 2500 | - | Vrms |
Turn-On Time | ton | IF = 10 mA, RL = 100 Ω, VCC = 5 V | - | 3 | - | μs |
Turn-Off Time | toff | IF = 10 mA, RL = 100 Ω, VCC = 5 V | - | 5 | - | μs |
Storage Temperature Range | TSTG | - | -40 | - | 85 | °C |
Operating Temperature Range | TA | - | -40 | - | 105 | °C |
Instructions for Use:
Power Supply:
- Ensure that the supply voltage (VCC) is within the specified range to avoid damage to the device.
- Use a stable power supply to minimize noise and interference.
Forward Current:
- The forward current (IF) should not exceed the maximum rating to prevent overheating and potential failure.
- Use a current-limiting resistor if necessary to control the forward current.
Reverse Voltage:
- Do not apply a reverse voltage greater than the specified breakdown voltage (VBR) to avoid damage to the phototransistor.
Output Current:
- The output current (IC) on the isolated side should not exceed the maximum rating to ensure reliable operation and prevent damage.
Isolation Voltage:
- The isolation voltage (VIORM) must be respected to maintain electrical isolation between the input and output sides. Exceeding this value can lead to breakdown and loss of isolation.
Timing Parameters:
- Consider the turn-on (ton) and turn-off (toff) times when designing circuits to ensure proper timing and avoid glitches.
Temperature Considerations:
- Operate the device within the specified storage (TSTG) and operating (TA) temperature ranges to ensure reliable performance and longevity.
- Avoid exposing the device to extreme temperatures or rapid temperature changes.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow proper soldering techniques to prevent thermal shock and mechanical stress.
Mounting:
- Ensure proper mounting and alignment to avoid mechanical stress on the leads.
- Use appropriate heat sinks if necessary to manage thermal dissipation.
Testing:
- Test the device under controlled conditions to verify its performance and functionality before integrating it into the final application.
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