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NJM2125F

Specifications

SKU: 508612

BUY NJM2125F https://www.utsource.net/itm/p/508612.html
SINGLE-SUPPLY OPERATIONAL AMPLIFIER
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc Operating 2.0 - 6.0 V
Quiescent Current IQ Vcc = 5V, No Load - 3.5 - mA
Output Current (Short Circuit) IOUT(SC) Vcc = 5V, Ta = 25°C - 300 - mA
Output Voltage Drop VD IOUT = 150mA - 0.7 - V
Dropout Voltage VDO IOUT = 150mA - 0.5 - V
Line Regulation LREG IOUT = 150mA, Vcc = 4.5V to 5.5V - 0.01 - %
Load Regulation LREG Vcc = 5V, IOUT = 0 to 150mA - 0.01 - %
Ripple Rejection RR f = 1kHz, Vcc = 5V 60 80 - dB
Operating Temperature Ta Storage -40 - 85 °C
Junction Temperature Tj Maximum - - 125 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the operating range of 2.0V to 6.0V.
    • Use appropriate decoupling capacitors (typically 0.1μF and 10μF) close to the input and output pins to stabilize the regulator.
  2. Output Current:

    • The maximum continuous output current is 300mA at room temperature (25°C).
    • For higher currents or temperatures, ensure adequate heat dissipation.
  3. Thermal Considerations:

    • The junction temperature should not exceed 125°C.
    • Use a heatsink if the device is expected to operate near its maximum power dissipation.
  4. Stability:

    • The NJM2125F is stable with ceramic and tantalum capacitors.
    • For optimal performance, use a 10μF capacitor on the output.
  5. Line and Load Regulation:

    • The line regulation is typically 0.01% over the specified input voltage range.
    • The load regulation is also typically 0.01% over the specified output current range.
  6. Ripple Rejection:

    • The device provides good ripple rejection, typically 80dB at 1kHz.
  7. Storage and Handling:

    • Store the device in a dry environment to prevent moisture damage.
    • Handle with care to avoid static discharge, which can damage the internal circuitry.
  8. Mounting:

    • Ensure proper soldering and alignment during PCB assembly.
    • Follow recommended PCB layout guidelines to minimize noise and improve thermal performance.
  9. Testing:

    • Test the device under typical operating conditions to verify correct functionality.
    • Measure the output voltage, current, and temperature to ensure they meet the specified parameters.
(For reference only)

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