Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage is within the specified range of 4.75V to 5.25V to avoid damage to the device.

2. Output Current:

   • The device can source up to 6mA and sink up to 16mA per output. Do not exceed these limits to prevent overheating or damage.

3. Input Voltage Levels:

   • For reliable operation, input voltages should be above 2.0V for a high logic level and below 0.8V for a low logic level.

4. Propagation Delay:

   • The propagation delay time is critical for timing-sensitive applications. It ranges from 10ns to 34ns under typical conditions.

5. Power Dissipation:

   • The maximum power dissipation is 350mW. Ensure proper heat sinking if operating near this limit to maintain device reliability.

6. Operating Temperature:

   • The device is designed to operate between -40°C and 85°C. Avoid exceeding these temperature limits to prevent performance degradation or failure.

7. Storage Temperature:

   • Store the device in an environment where the temperature does not fall below -65°C or rise above 150°C to ensure long-term reliability.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits. Use appropriate ESD protection measures.

9. Mounting:

   • When mounting the device on a PCB, ensure that all connections are secure and follow the recommended soldering profile to avoid thermal stress.

10. Testing:

    • Before integrating the device into a larger system, perform initial testing to verify its functionality and ensure it meets the required specifications.