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74F164APC

Specifications

SKU: 603013

BUY 74F164APC https://www.utsource.net/itm/p/603013.html
Serial-In Parallel-Out Shift Register; Package: DIP; No of Pins: 14; Container: Rail
Parameter Symbol Min Typ Max Unit Notes
Supply Voltage VCC 4.5 5.0 5.5 V
Output High Voltage VOH - 2.7 VCC-0.4 V At IOL = 0.4 mA
Output Low Voltage VOL 0 0.4 0.5 V At IOH = -8 mA
Input High Voltage VIH 2.0 - VCC V
Input Low Voltage VIL 0 - 0.8 V
Propagation Delay Time tpd - 15 25 ns Typical at VCC = 5V
Power Consumption Ptot - - 300 mW Maximum at VCC = 5V
Operating Temperature Range TA -40 - 85 °C Industrial grade
Storage Temperature Range TSTG -65 - 150 °C

Instructions for 74F164APC

  1. Power Supply:

    • Connect the VCC pin to a 5V power supply.
    • Connect the GND pin to ground.
  2. Input Signals:

    • Serial Data Input (DS): Connect this pin to the data source.
    • Shift Clock (SHCP): Connect this pin to the clock signal that shifts data into the register.
    • Storage Clock (STCP): Connect this pin to the clock signal that transfers data from the shift register to the storage register.
    • Output Enable (OE): Connect this pin to control the output state. Active low (0V) enables the outputs; high (5V) disables them.
  3. Output Signals:

    • Q0-Q7: These pins provide the parallel output of the data stored in the register.
  4. Operation:

    • Shift Mode: When SHCP is high, data on the DS pin is shifted into the register on the falling edge of SHCP.
    • Storage Mode: When STCP is high, the data in the shift register is transferred to the storage register on the falling edge of STCP.
    • Output Control: The OE pin controls whether the outputs are active or not. Set OE to 0V to enable the outputs, and 5V to disable them.
  5. Timing Considerations:

    • Ensure that the propagation delay time (tpd) is considered when designing the timing of your circuit to avoid data corruption.
  6. Handling:

    • The 74F164APC is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
  7. Mounting:

    • Ensure proper heat dissipation if operating at maximum power consumption. Use a heatsink if necessary.
  8. Testing:

    • Test the device under typical operating conditions to ensure it meets the specified parameters.
(For reference only)

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