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CD74HCT4052E

Specifications

SKU: 606461

BUY CD74HCT4052E https://www.utsource.net/itm/p/606461.html
LMC6062 Precision CMOS Dual Micropower Operational Amplifier; Package: MDIP; No of Pins: 8
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Continuous 2.0 - 6.0 V
Input Voltage (High Level) VIH VI = VCC 3.15 - VCC V
Input Voltage (Low Level) VIL VI = 0V 0 - 0.8 V
Output Voltage (High Level) VOH IO = -1mA, VCC = 5V 2.4 - VCC - 0.1 V
Output Voltage (Low Level) VOL IO = 1mA, VCC = 5V 0 - 0.1 V
Input Leakage Current IIL VCC = 5V -1 - 1 μA
Output Leakage Current IOL VCC = 5V -1 - 1 μA
Channel-to-Channel Isolation - f = 100kHz, VCC = 5V - - 100 dB
Switching Time tpd VCC = 5V, f = 10MHz - 10 35 ns
Maximum Junction Temperature TJ - - - 150 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
    • Connect the ground (GND) pin to the common ground of your circuit.
  2. Input Signals:

    • The input signals should be within the specified high (VIH) and low (VIL) levels to ensure proper operation.
    • Avoid exceeding the maximum input voltage, which should not exceed VCC.
  3. Output Signals:

    • The output signals will be within the specified high (VOH) and low (VOL) levels.
    • Ensure the load connected to the output does not draw more current than the device can handle.
  4. Channel Selection:

    • Use the select lines (S0, S1) to choose the active channel.
    • The enable line (EN) must be set to a low level to activate the selected channel.
  5. Temperature Considerations:

    • Ensure the device operates within the specified junction temperature (TJ) and storage temperature (TSTG) ranges to avoid damage.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow proper soldering techniques to prevent thermal stress on the device.
  7. Testing:

    • Before integrating the device into a final application, test it under typical operating conditions to ensure it meets the required specifications.
  8. Layout Considerations:

    • Place the device close to other components to minimize signal degradation.
    • Use decoupling capacitors near the power supply pins to reduce noise and improve stability.
(For reference only)

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