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A3955SLBTR

Specifications

SKU: 735397

BUY A3955SLBTR https://www.utsource.net/itm/p/735397.html
FULL-BRIDGE PWM MICROSTEPPING MOTOR DRIVER
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Continuous 8 - 50 V
Supply Current ICC All outputs off, TA = 25°C - 40 - mA
Output Current per Channel IOUT Continuous, TA = 25°C - 1.2 2.0 A
Maximum Power Dissipation PD TA = 25°C - - 20 W
Operating Temperature Range TA - -40 - 125 °C
Storage Temperature Range TSTG - -65 - 150 °C
Junction Temperature TJ - - - 150 °C
Thermal Resistance, Junction to Ambient RθJA - - 35 - °C/W
Thermal Resistance, Junction to Case RθJC - - 2.0 - °C/W

Instructions for Using A3955SLBTR:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 8V to 50V to avoid damage to the device.
    • Use appropriate voltage regulation to maintain a stable supply.
  2. Supply Current (ICC):

    • The device draws approximately 40mA when all outputs are off and at room temperature.
    • Ensure the power supply can handle this current plus any additional load current.
  3. Output Current per Channel (IOUT):

    • Each channel can handle up to 2.0A continuously at room temperature.
    • For higher currents or temperatures, ensure adequate heat dissipation.
  4. Maximum Power Dissipation (PD):

    • The maximum power dissipation is 20W at room temperature.
    • Use heatsinks or other cooling methods if operating near this limit.
  5. Operating Temperature Range (TA):

    • The device operates reliably between -40°C and 125°C.
    • Avoid exceeding these limits to prevent performance degradation or failure.
  6. Storage Temperature Range (TSTG):

    • Store the device between -65°C and 150°C to ensure long-term reliability.
    • Avoid exposing the device to extreme temperatures for extended periods.
  7. Junction Temperature (TJ):

    • The maximum junction temperature is 150°C.
    • Monitor the junction temperature to avoid thermal shutdown or damage.
  8. Thermal Resistance:

    • RθJA (Junction to Ambient) is 35°C/W.
    • RθJC (Junction to Case) is 2.0°C/W.
    • Use these values to design effective heat dissipation solutions.

Additional Notes:

  • Always refer to the datasheet for the most accurate and detailed information.
  • Ensure proper PCB layout and grounding to minimize noise and interference.
  • Use external components as recommended in the datasheet to optimize performance.
(For reference only)

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