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STTH8R06G-TR

Specifications

SKU: 758110

BUY STTH8R06G-TR https://www.utsource.net/itm/p/758110.html
TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER
Parameter Symbol Min Typ Max Unit Description
Rated Voltage VRMS - 400 - V Maximum continuous RMS voltage
Peak Repetitive Voltage VDRM - 580 - V Maximum peak repetitive off-state voltage
On-State Current ITSM - 8.0 - A Non-repetitive surge on-state current
Holding Current IH - 10 - mA Minimum current required to maintain on state
Gate Trigger Current IGT - 20 - mA Maximum gate trigger current
Gate Trigger Voltage VGT - 1.5 - V Maximum gate trigger voltage
Power Dissipation PT - 110 - W Maximum power dissipation at TA = 25°C
Junction Temperature TJ - - 125 °C Maximum junction temperature
Storage Temperature TSTG -65 - 150 °C Operating temperature range

Instructions for Use

  1. Voltage Handling:

    • Ensure that the operating voltage does not exceed the rated RMS voltage (400V) and the peak repetitive voltage (580V).
    • Avoid subjecting the device to voltages higher than its maximum ratings to prevent damage.
  2. Current Handling:

    • The device can handle a non-repetitive surge current of up to 8.0A. For continuous operation, ensure the current is within safe limits.
    • The holding current (10mA) must be maintained to keep the device in the on state.
  3. Gate Control:

    • Apply a gate trigger current of at least 20mA and a gate trigger voltage of at least 1.5V to turn the device on.
    • Ensure the gate circuit is properly designed to provide these parameters reliably.
  4. Thermal Management:

    • The maximum power dissipation is 110W at an ambient temperature of 25°C. Use appropriate heat sinks or cooling methods to manage heat dissipation.
    • The junction temperature should not exceed 125°C to avoid thermal damage.
  5. Environmental Conditions:

    • Store the device in a temperature range of -65°C to 150°C to ensure reliability and longevity.
    • Avoid exposing the device to extreme environmental conditions that could affect its performance.
  6. Mounting and Handling:

    • Handle the device with care to avoid mechanical stress or damage.
    • Follow recommended soldering profiles and mounting guidelines to ensure proper installation.
  7. Testing and Troubleshooting:

    • Regularly test the device to ensure it is functioning within specified parameters.
    • If issues arise, check for proper voltage and current levels, as well as thermal management.

For detailed application notes and further technical information, refer to the datasheet provided by STMicroelectronics.

(For reference only)

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