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Specifications
SKU: 761385
SWITCHMODE TM Power Rectifiers
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Average Rectified Current (Non-repetitive) | IF(AV) | - | 15 | - | A | |
| Peak Forward Surge Current (Non-repetitive) | IFSM | 200 | - | - | A | t = 8.3 ms, sin half-wave |
| Maximum Reverse Voltage | VRM | - | 600 | - | V | |
| Forward Voltage at Rated Current | VF | - | 1.1 | - | V | IF = 15 A |
| Reverse Current at Maximum Reverse Voltage | IR | - | 50 | - | μA | VR = 600 V, TJ = 25°C |
| Junction Temperature | TJ | -55 | - | 175 | °C | |
| Storage Temperature | TSTG | -55 | - | 150 | °C | |
| Operating Temperature | TOPR | -55 | - | 125 | °C | |
| Thermal Resistance, Junction to Case | RθJC | - | 0.6 | - | °C/W | |
| Thermal Resistance, Junction to Ambient | RθJA | - | 40 | - | °C/W |
Instructions:
- Mounting: Ensure the device is mounted with adequate heat sinking to maintain the junction temperature within the specified limits.
- Current Handling: Do not exceed the average rectified current (IF(AV)) or peak forward surge current (IFSM) ratings. For continuous operation, stay within the average rectified current limit.
- Voltage Handling: Ensure that the maximum reverse voltage (VRM) is not exceeded to prevent breakdown.
- Temperature Management: Monitor the junction temperature (TJ) to avoid exceeding the maximum allowable temperature. Use appropriate cooling methods if necessary.
- Storage and Operation: Store the device within the storage temperature (TSTG) range and operate it within the operating temperature (TOPR) range to ensure reliability.
- Thermal Design: Consider the thermal resistance (RθJC and RθJA) in your design to ensure effective heat dissipation.
- Surge Protection: For applications involving high surge currents, ensure that the peak forward surge current (IFSM) rating is not exceeded for the specified duration.
- Polarity Check: Always check the polarity before connecting the diode to avoid reverse polarity damage.
- Soldering: Follow recommended soldering profiles to avoid thermal shock and potential damage to the device.
Inquiry - MUR460RLG
