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Specifications
SKU: 826469
Power MOSFET -30V, -1.95 A, Single, P-Channel SOT-23; Package: SOT-23 TO-236 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000
| Parameter | Symbol | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage | VCC | 4.5 | - | 5.5 | V |
| Quiescent Current | IQ | - | 0.5 | - | μA |
| Output Current (Sink) | IOL | 50 | - | 100 | mA |
| Output Current (Source) | IOH | 50 | - | 100 | mA |
| Output Low Voltage | VOL | - | 0.4 | - | V |
| Output High Voltage | VOH | - | 4.5 | - | V |
| Input Voltage (High) | VIH | 3.5 | - | 5.5 | V |
| Input Voltage (Low) | VIL | 0 | - | 1.5 | V |
| Propagation Delay Time | tpd | - | 10 | - | ns |
| Storage Temperature | TSTG | -65 | - | 150 | °C |
| Operating Temperature | TA | -40 | - | 85 | °C |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
Quiescent Current:
- The quiescent current is typically 0.5 μA, which is very low, making the device suitable for low-power applications.
Output Current:
- The device can sink or source up to 100 mA of current. Ensure that the load does not exceed this limit to prevent damage.
Output Voltage Levels:
- When the output is low, the voltage will be around 0.4V.
- When the output is high, the voltage will be around 4.5V.
Input Voltage Levels:
- For the input to be recognized as high, it must be between 3.5V and 5.5V.
- For the input to be recognized as low, it must be between 0V and 1.5V.
Propagation Delay:
- The typical propagation delay time is 10 ns, which is the time it takes for the output to change state after the input changes.
Temperature Ranges:
- The storage temperature range is from -65°C to 150°C.
- The operating temperature range is from -40°C to 85°C. Ensure the device operates within these limits to maintain reliability.
Handling:
- Handle the device with care to avoid static discharge, which can damage the sensitive components.
- Follow proper soldering techniques to ensure good electrical connections and avoid thermal stress on the device.
Mounting:
- Mount the device on a PCB with appropriate thermal management if high power dissipation is expected.
- Ensure that the PCB layout follows best practices for signal integrity and noise reduction.
Inquiry - NTR4502PT1G
