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Specifications
SKU: 855098
75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to IRFB3307 with Lead Free Packaging
| Parameter | Symbol | Test Conditions | Min | Typical | Max | Unit |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | -55 | - | 55 | V |
| Gate-Source Voltage | VGS | - | -12 | - | 12 | V |
| Continuous Drain Current (TC = 25°C) | ID | - | - | 74 | - | A |
| Continuous Drain Current (TC = 100°C) | ID | - | - | 49 | - | A |
| Pulse Drain Current (TA = 25°C, tp = 10 μs, Duty Cycle = 1%) | IDpeak | - | - | 220 | - | A |
| Total Power Dissipation (TC = 25°C) | PTOT | - | - | 240 | - | W |
| Total Power Dissipation (TC = 100°C) | PTOT | - | - | 150 | - | W |
| Junction Temperature | TJ | - | - | - | 175 | °C |
| Storage Temperature Range | TSTG | - | -65 | - | 150 | °C |
| Thermal Resistance, Junction to Case | RθJC | - | - | 0.38 | - | °C/W |
| Thermal Resistance, Junction to Ambient | RθJA | - | - | 2.1 | - | °C/W |
Instructions for Use:
Mounting and Handling:
- Ensure that the device is handled with care to avoid mechanical damage.
- Use appropriate heat sinks or cooling methods to manage thermal resistance and maintain the junction temperature within safe limits.
Electrical Connections:
- Connect the drain (D), source (S), and gate (G) terminals correctly to avoid short circuits or incorrect operation.
- Ensure that the gate-source voltage (VGS) does not exceed the maximum rating to prevent damage to the device.
Operating Conditions:
- Operate the device within the specified drain-source voltage (VDS) and continuous drain current (ID) ratings.
- For pulse applications, ensure that the pulse drain current (IDpeak) and duty cycle do not exceed the specified limits.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it remains below the maximum rating.
- Use the thermal resistance values (RθJC and RθJA) to design effective cooling solutions.
Storage:
- Store the device in a dry, cool environment within the specified storage temperature range (TSTG).
Testing:
- Perform regular testing to ensure the device is functioning within its specified parameters.
- Use appropriate test equipment and procedures to avoid damaging the device during testing.
Inquiry - IRFB3307PBF
