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XC2S100-5TQG144C

Specifications

SKU: 872348

BUY XC2S100-5TQG144C https://www.utsource.net/itm/p/872348.html
100000 SYSTEM GATE 2.5 VOLT LOGIC CELL A - NOT RECOMMENDED for NEW DESIGN
Parameter Description
Device XC2S100-5TQG144C
Family Spartan-2 Series
Logic Cells 100,000
I/O Pins 116
Package TQFP (144-pin)
Speed Grade -5 (ns)
Configuration Memory 1.5 Mb
Internal Oscillator Yes
External Clock Input Yes
Operating Voltage 3.3V
Operating Temperature Range -40°C to +85°C
Power Consumption Low Power
JTAG Boundary-Scan Yes
Partial Reconfiguration Yes
Built-in Self-Test (BIST) Yes

Instructions for XC2S100-5TQG144C

  1. Power Supply:

    • Ensure that the device is powered with a stable 3.3V supply.
    • Use decoupling capacitors close to the power pins to minimize noise.
  2. Configuration:

    • The device can be configured using various methods including JTAG, Master Serial, Slave Serial, and others.
    • Use the appropriate configuration file generated by Xilinx ISE or Vivado tools.
  3. Clocking:

    • Connect an external clock source to the dedicated clock input pins if required.
    • Utilize the internal oscillator for basic clocking needs.
  4. I/O Handling:

    • Set the I/O standards and drive strengths as per the design requirements.
    • Ensure proper termination and matching for high-speed signals to avoid reflections and signal integrity issues.
  5. Boundary-Scan Testing:

    • Use the JTAG boundary-scan feature for testing and debugging.
    • Follow the JTAG chain setup guidelines provided in the Xilinx documentation.
  6. Partial Reconfiguration:

    • Implement partial reconfiguration to dynamically change parts of the FPGA logic without resetting the entire device.
    • Use the Xilinx tools to generate and manage the partial bitstreams.
  7. Built-in Self-Test (BIST):

    • Utilize BIST features to perform self-diagnostic tests.
    • Integrate BIST into your design for enhanced reliability and fault detection.
  8. Thermal Management:

    • Ensure adequate cooling for the device, especially in high-density and high-power applications.
    • Monitor the device temperature and use heatsinks or fans if necessary.
  9. Handling and Storage:

    • Handle the device with care to avoid ESD damage.
    • Store the device in a dry, static-free environment.
  10. Documentation:

    • Refer to the Xilinx Spartan-2 Series datasheet and user guides for detailed information and specific design considerations.

For more detailed information, refer to the official Xilinx documentation and datasheets for the XC2S100-5TQG144C.

(For reference only)

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