BUY GX1-300B-85-2.0 https://www.utsource.net/itm/p/879565.html
Power Integrated x86-Compatible 32-Bit Processor ( X8632
GX1-300B-85-2.0 is a BGA (Ball Grid Array) package from NXP Semiconductors. It is a low-power, high-speed CMOS logic device with a wide operating temperature range of -40°C to +85°C. Description: The GX1-300B-85-2.0 is a low-power, high-speed CMOS logic device with a wide operating temperature range of -40°C to +85°C. It features a low-power consumption of 2.0 mW/MHz and a high-speed operation of up to 300 MHz. Features: Low power consumption of 2.0 mW/MHz High-speed operation of up to 300 MHz Wide operating temperature range of -40°C to +85°C BGA (Ball Grid Array) package Applications: The GX1-300B-85-2.0 is suitable for a variety of applications, including consumer electronics, automotive, industrial, and medical. It can be used for data processing, signal processing, and communication applications. (For reference only)