Instructions for Use:

1. Mounting: Ensure that the device is mounted with sufficient clearance to prevent overheating. The leads should be bent carefully to avoid mechanical stress.
2. Soldering: Use a temperature-controlled soldering iron set to a maximum of 300°C. Soldering time should not exceed 5 seconds per lead.
3. Handling: Handle the device with care to avoid damage to the leads or the body. Use anti-static precautions to prevent electrostatic discharge (ESD) damage.
4. Circuit Design: Ensure that the operating conditions do not exceed the maximum ratings listed in the table. Use appropriate current-limiting resistors to protect the device from excessive current.
5. Testing: When testing the device, use a low-voltage power supply and current-limiting resistors to avoid damaging the phototransistor.
6. Storage: Store the device in a dry, cool place away from direct sunlight and sources of heat. Avoid exposure to corrosive environments.