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H11A2

Specifications

SKU: 910701

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OPTOISOLATOR W/BASE 6-DIP
Parameter Description Value
Part Number Photocoupler H11A2
Input Device Light Emitting Diode (LED) GaAs
Output Device Phototransistor Si NPN
Isolation Voltage Minimum Working Voltage (VISO) 5300 Vrms
Forward Current (IF) Continuous Forward Current (IF) 20 mA
Peak Forward Current (IFM) Non-Repetitive Peak Forward Current (IFM) 1 A
Forward Voltage (VF) Forward Voltage at IF = 20 mA 1.2 V
Reverse Voltage (VR) Maximum Reverse Voltage 5 V
Collector-Emitter Voltage (VCE) Maximum Collector-Emitter Voltage 70 V
Collector Current (IC) Continuous Collector Current 50 mA
Current Transfer Ratio (CTR) Minimum CTR at IF = 5 mA, VCE = 5 V 20% to 400%
Rise Time (tr) Rise Time at IF = 5 mA, RL = 1 kΩ 2 μs
Fall Time (tf) Fall Time at IF = 5 mA, RL = 1 kΩ 2 μs
Operating Temperature (TJ) Junction Temperature Range -40°C to 100°C
Storage Temperature (TSTG) Storage Temperature Range -40°C to 125°C
Package Type DIP-4 DIP-4

Instructions for Use:

  1. Power Supply:

    • Ensure the forward current (IF) through the LED does not exceed 20 mA continuously.
    • The reverse voltage (VR) across the LED should not exceed 5 V.
  2. Output Circuit:

    • The collector-emitter voltage (VCE) should not exceed 70 V.
    • The continuous collector current (IC) should not exceed 50 mA.
  3. Current Transfer Ratio (CTR):

    • The CTR can vary from 20% to 400% at IF = 5 mA and VCE = 5 V. Design your circuit to accommodate this range for reliable operation.
  4. Timing Parameters:

    • The rise time (tr) and fall time (tf) are both 2 μs under typical conditions (IF = 5 mA, RL = 1 kΩ). Consider these values when designing high-speed circuits.
  5. Temperature Considerations:

    • Operate the device within the junction temperature range of -40°C to 100°C.
    • Store the device within the storage temperature range of -40°C to 125°C.
  6. Mounting and Handling:

    • Handle the device with care to avoid mechanical damage.
    • Follow standard ESD (Electrostatic Discharge) precautions to prevent damage to the sensitive components.
  7. Soldering:

    • Solder the device at a temperature not exceeding 260°C for a duration not exceeding 10 seconds.
    • Allow the device to cool naturally after soldering to avoid thermal shock.
  8. Testing:

    • Test the device under controlled conditions to ensure it meets the specified parameters.
    • Verify the CTR and timing parameters to confirm proper operation.

By following these guidelines, you can ensure optimal performance and reliability of the H11A2 photocoupler in your application.

(For reference only)

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