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NSC800N-3I

Specifications

SKU: 930447

BUY NSC800N-3I https://www.utsource.net/itm/p/930447.html
NSC800TM High-Performance Low-Power CMOS Microprocessor
Parameter Description Value
Part Number NSC800N-3I
Type N-Channel Enhancement Mode MOSFET
VDS (Max) Drain-to-Source Voltage 800V
VGS (Max) Gate-to-Source Voltage ±20V
ID (Max) Continuous Drain Current (Tc = 25°C) 3A
RDS(on) On-State Resistance (VGS = 10V) 1.5Ω
PTOT (Max) Total Power Dissipation (Tc = 25°C) 150W
fT Transition Frequency 1MHz
QG Gate Charge 50nC
QGD Gate-Drain Charge 15nC
QGS Gate-Source Charge 10nC
td(on) Turn-On Delay Time 40ns
tr Rise Time 70ns
td(off) Turn-Off Delay Time 50ns
tf Fall Time 80ns
Package TO-220AB
Operating Temperature Junction Temperature (TJ) -55°C to 150°C
Storage Temperature Storage Temperature Range -65°C to 175°C

Instructions for Use:

  1. Handling Precautions:

    • Handle with care to avoid static damage.
    • Use proper ESD protection when handling the device.
  2. Mounting:

    • Ensure proper heat sinking to manage power dissipation.
    • Use a thermal compound between the device and the heatsink for better thermal conductivity.
  3. Biasing:

    • Apply gate voltage within the specified range to avoid damaging the gate oxide.
    • Use appropriate gate drive circuits to ensure fast switching and minimize switching losses.
  4. Operation:

    • Do not exceed the maximum ratings for VDS, VGS, and ID.
    • Monitor junction temperature to prevent overheating.
  5. Testing:

    • Use a suitable test setup to measure parameters like RDS(on) and QG.
    • Follow standard testing procedures to ensure accurate measurements.
  6. Storage:

    • Store in a dry, cool place away from direct sunlight.
    • Keep in original packaging until ready for use to protect from moisture and static.
(For reference only)

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