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PAL10L8CN

Specifications

SKU: 955408

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Combinatorial PAL10H8 Series
Parameter Description Value
Package The type of package 20-Pin Plastic DIP (PDIP)
Operating Voltage (Vcc) Supply voltage range 4.5V to 5.5V
Maximum Current per Output (Ioh/Iol) Maximum output current (high/low) ±25mA
Propagation Delay Time (tpd) Typical propagation delay time at Vcc = 5V 12ns (max)
Power Dissipation (Pd) Maximum power dissipation 360mW
Operating Temperature Range (Toper) Operating temperature range -40°C to +85°C
Storage Temperature Range (Tstg) Storage temperature range -65°C to +150°C
Input Leakage Current (Iil) Maximum input leakage current at Vcc = 5V ±1μA
Output Leakage Current (Iol) Maximum output leakage current at Vcc = 5V ±100μA
Input Capacitance (Cin) Input capacitance at Vcc = 5V 10pF (typ)
Output Capacitance (Cout) Output capacitance at Vcc = 5V 15pF (typ)

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations that can affect performance.
  2. Pin Configuration:

    • Refer to the pin configuration diagram provided in the datasheet to correctly connect the device.
    • Pin 1 is typically marked with a dot or notch on the package.
  3. Signal Levels:

    • Inputs should be driven to valid logic levels (0V for low, 5V for high).
    • Outputs can drive up to ±25mA, but ensure the load does not exceed this limit.
  4. Decoupling Capacitors:

    • Place a 0.1μF ceramic decoupling capacitor as close as possible to the Vcc and GND pins to filter out noise and stabilize the power supply.
  5. Temperature Considerations:

    • Operate the device within the specified temperature range (-40°C to +85°C) to ensure reliable performance.
    • Store the device in a dry environment within the storage temperature range (-65°C to +150°C).
  6. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal circuitry.
    • Use proper ESD (Electrostatic Discharge) protection measures when handling the device.
  7. Testing:

    • Before integrating the device into a larger system, test it individually to ensure it meets the required specifications.
    • Use appropriate test equipment and methods to avoid damaging the device during testing.
(For reference only)

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