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TC514402AZ-60

Specifications

SKU: 981600

BUY TC514402AZ-60 https://www.utsource.net/itm/p/981600.html
IC 1M X 4 STATIC COLUMN DRAM, 60 ns, PZIP20, 0.400 INCH, PLASTIC, ZIP-20, Dynamic RAM
Parameter Description Value Unit
Part Number Device Identifier TC514402AZ-60 -
Function Device Type Step-Up DC/DC Converter -
Input Voltage Range Operating Voltage Range 2.7 to 5.5 V
Output Voltage Fixed Output Voltage 6.0 V
Output Current Maximum Continuous Output Current 300 mA
Switching Frequency Internal Oscillator Frequency 1.2 MHz
Efficiency Typical Efficiency at 3.3V In, 6V Out, 100mA Load 85 %
Quiescent Current Operating Quiescent Current 25 μA
Shutdown Current Shutdown Mode Current 0.1 μA
Operating Temperature Range Ambient Operating Temperature -40 to 85 °C
Package Type Encapsulation SOT-23-6 -
Pin Configuration Pin Count 6 -

Instructions:

  1. Power Supply Connection:

    • Connect the input voltage (2.7V to 5.5V) to the VIN pin.
    • Connect the output load to the VOUT pin.
    • Ensure proper decoupling capacitors are placed close to the VIN and VOUT pins for stable operation.
  2. Inductor Selection:

    • Choose an inductor with a value between 1.0μH and 4.7μH for optimal performance.
    • Ensure the inductor can handle the maximum output current (300mA).
  3. Capacitor Selection:

    • Use a 10μF ceramic capacitor for the input (VIN) to ensure stable input voltage.
    • Use a 10μF ceramic capacitor for the output (VOUT) to filter the output voltage and reduce ripple.
  4. Shutdown Mode:

    • To enter shutdown mode, pull the SHDN pin low (0V).
    • The device will consume less than 0.1μA in shutdown mode.
  5. Thermal Considerations:

    • Ensure adequate heat dissipation if operating at high temperatures or under heavy loads.
    • The device is designed to operate within the temperature range of -40°C to 85°C.
  6. Layout Recommendations:

    • Keep the PCB traces short and wide to minimize parasitic inductance and resistance.
    • Place the inductor and capacitors as close as possible to the IC to reduce noise and improve stability.
  7. Storage and Handling:

    • Store the device in a dry environment to prevent moisture damage.
    • Handle the device with care to avoid static discharge, which can damage the IC.
  8. Regulatory Compliance:

    • Ensure that the device meets all relevant regulatory standards for your application, including EMC and safety requirements.
(For reference only)

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