Share:


UPC1358H

Specifications

SKU: 981754

BUY UPC1358H https://www.utsource.net/itm/p/981754.html
BIPOLAR ANALOG INTERGRATED CIRCUIT
Parameter Symbol Min Typical Max Unit Notes
Input Voltage V_IN 2.7 - 5.5 V
Output Voltage V_OUT 1.8 - 5.0 V Adjustable
Output Current I_OUT - 1.5 3.0 A
Quiescent Current I_Q - 20 40 μA
Dropout Voltage V_DROPOUT - 0.2 0.5 V At I_OUT = 3.0A
Power Dissipation P_DISS - - 15 W
Operating Temperature T_OP -40 - 125 °C
Storage Temperature T_STOR -65 - 150 °C
Thermal Resistance (θJA) θJA - 25 - °C/W

Instructions for Use:

  1. Input Voltage (V_IN):

    • Ensure the input voltage is within the range of 2.7V to 5.5V.
    • Avoid exceeding the maximum input voltage to prevent damage.
  2. Output Voltage (V_OUT):

    • The output voltage is adjustable between 1.8V and 5.0V.
    • Use an external resistor network to set the desired output voltage.
  3. Output Current (I_OUT):

    • The device can provide up to 3.0A of output current.
    • For optimal performance, keep the load current within the typical range of 1.5A.
  4. Quiescent Current (I_Q):

    • The quiescent current is typically around 20μA.
    • This low quiescent current helps in minimizing power loss when the device is active but not driving a load.
  5. Dropout Voltage (V_DROPOUT):

    • The dropout voltage is the difference between the input and output voltages at which the regulator can still maintain regulation.
    • At a load current of 3.0A, the dropout voltage is typically 0.2V and can go up to 0.5V.
  6. Power Dissipation (P_DISS):

    • The maximum power dissipation is 15W.
    • Ensure adequate heat sinking or cooling to manage power dissipation, especially under high load conditions.
  7. Operating Temperature (T_OP):

    • The operating temperature range is from -40°C to 125°C.
    • Avoid exposing the device to temperatures outside this range to ensure reliable operation.
  8. Storage Temperature (T_STOR):

    • The storage temperature range is from -65°C to 150°C.
    • Store the device in a dry environment to prevent moisture-related issues.
  9. Thermal Resistance (θJA):

    • The thermal resistance from junction to ambient is typically 25°C/W.
    • Use a heatsink if the application requires high power dissipation to maintain a safe operating temperature.
  10. PCB Layout:

    • Place the device close to the load to minimize trace inductance and improve stability.
    • Use wide and short traces for power and ground connections to reduce parasitic inductance and resistance.
  11. Capacitors:

    • Use ceramic capacitors with low ESR for input and output filtering.
    • Place the input capacitor as close as possible to the input pin to filter out noise.
    • Place the output capacitor close to the output pin to stabilize the output voltage.
  12. Protection:

    • The device includes over-temperature and short-circuit protection.
    • However, it is recommended to add external fuses or current-limiting resistors for additional protection.
  13. Adjustment:

    • To adjust the output voltage, use the following formula: [ V_ = V_ left(1 + fracright) ] where ( V_ ) is the reference voltage (typically 1.25V), and ( R_1 ) and ( R_2 ) are the external resistors.
  14. Stability:

    • Ensure the loop stability by using appropriate compensation components if necessary.
    • Refer to the datasheet for specific recommendations on compensation networks.
(For reference only)

 Inquiry - UPC1358H