Instructions for Use:

1. Mounting and Handling:

   • Ensure proper handling to avoid damage from electrostatic discharge (ESD).
   • Use appropriate heat sinks or cooling methods to manage power dissipation and junction temperature.

2. Biasing:

   • Apply gate-source voltage (V_GS) within the specified range to control the drain current.
   • Avoid exceeding the maximum drain-source voltage (V_DS) to prevent device breakdown.

3. Current Limitation:

   • Do not exceed the continuous drain current (I_D) ratings at the specified case temperatures.
   • For pulse applications, ensure the pulse duration and frequency do not exceed the pulse drain current (I_D(p)) limits.

4. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it does not exceed 150°C.
   • Use thermal resistance (R_θJC) data to design effective cooling solutions.

5. Storage:

   • Store the device in a dry, cool environment within the storage temperature range (-55°C to 150°C).

6. Testing:

   • Use the specified test conditions for input capacitance (C_iss), output capacitance (C_oss), and reverse transfer capacitance (C_rss) when conducting electrical tests.

7. Safety:

   • Follow all safety guidelines and regulations when handling and operating the device.
   • Ensure proper grounding and isolation to prevent electrical hazards.