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TB2132FNG

Specifications

SKU: 1038529

BUY TB2132FNG https://www.utsource.net/itm/p/1038529.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage Vcc 4.5 5.5 V Operating supply voltage
Input Voltage Range Vin 0 Vcc V Range for input signals
Output Voltage Swing Vout 0.3 Vcc-0.3 V Output voltage swing relative to supply
Quiescent Current Iq 1.5 2.5 mA Current consumed by the device when idle
Output Current Iout 20 50 mA Maximum output current per channel
Channel-to-Channel Isolation Iiso 100 dB Isolation between channels at 1 kHz
Bandwidth BW 20 30 MHz Frequency range where gain is within 3 dB
Slew Rate SR 1000 1500 V/μs Rate of change of output voltage
Power Dissipation Pd 625 mW Maximum power dissipation at TA = 25°C
Operating Temperature Ta -40 85 °C Ambient temperature range for operation
Storage Temperature Tstg -65 150 °C Temperature range for storage

Instructions for Use

  1. Supply Voltage:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
    • Connect the Vcc pin to a stable power source.
  2. Input Signals:

    • The input voltage (Vin) should be within the range of 0V to Vcc.
    • Avoid exceeding the maximum input voltage to prevent damage to the device.
  3. Output Configuration:

    • The output voltage swing (Vout) will be from 0.3V to Vcc - 0.3V.
    • Ensure the load connected to the output can handle the maximum output current (Iout).
  4. Quiescent Current:

    • The device consumes a quiescent current (Iq) of 1.5 to 2.5 mA when idle.
    • This current should be accounted for in the power budget.
  5. Channel-to-Channel Isolation:

    • Channels are isolated up to 100 dB at 1 kHz, ensuring minimal crosstalk between channels.
  6. Bandwidth:

    • The device operates effectively within a bandwidth of 20 to 30 MHz.
    • Signals outside this range may experience reduced performance.
  7. Slew Rate:

    • The slew rate (SR) is 1000 to 1500 V/μs, indicating the maximum rate of change of the output voltage.
    • This parameter is crucial for high-frequency applications.
  8. Power Dissipation:

    • The maximum power dissipation (Pd) is 625 mW at an ambient temperature of 25°C.
    • Ensure adequate heat dissipation if operating near the maximum power limit.
  9. Operating Temperature:

    • The device is designed to operate within an ambient temperature range of -40°C to 85°C.
    • Avoid operating in environments outside this range to prevent thermal stress.
  10. Storage Temperature:

    • Store the device in an environment with a temperature range of -65°C to 150°C to ensure long-term reliability.
  11. Handling and ESD Protection:

    • Handle the device with care to avoid static discharge.
    • Use proper ESD protection measures during handling and assembly.
  12. Mounting and Layout:

    • Follow recommended PCB layout guidelines to minimize noise and improve performance.
    • Ensure proper grounding and decoupling capacitors are used as specified in the datasheet.
(For reference only)

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