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DG413

Specifications

SKU: 1048597

BUY DG413 https://www.utsource.net/itm/p/1048597.html
Improved, Quad,SPST Analog Switches4
Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VDD 2.5 - 18 V -
Input Voltage (Common Mode) VI(CM) 0 - VDD V -
Output Voltage Swing (Low Level) VOL 0 - 0.1 V IOL = 1 mA, VDD = 5 V
Output Voltage Swing (High Level) VOH 4.9 - VDD - 0.1 V IOH = -1 mA, VDD = 5 V
Leakage Current (ON State) ION - - 1 μA VDD = 5 V, TA = 25°C
Leakage Current (OFF State) IOFF - - 1 nA VDD = 5 V, TA = 25°C
Switching Time (ON to OFF) toff - 25 - ns VDD = 5 V, RL = 1 kΩ, CL = 10 pF
Switching Time (OFF to ON) ton - 25 - ns VDD = 5 V, RL = 1 kΩ, CL = 10 pF
Power Dissipation PD - - 150 mW TA = 25°C
Operating Temperature Range TA -40 - 85 °C -

Instructions for Use:

  1. Supply Voltage: Ensure that the supply voltage (VDD) is within the range of 2.5 V to 18 V.
  2. Input Voltage: The input voltage should be within the common mode range from 0 V to VDD.
  3. Output Voltage Swing: The output voltage swing should be within the specified limits for both low and high levels, depending on the load current and supply voltage.
  4. Leakage Current: Keep the leakage current within the specified limits to avoid excessive power consumption or signal degradation.
  5. Switching Time: The switching times (toff and ton) are critical for ensuring proper operation of the switch. Ensure that the load resistance (RL) and capacitance (CL) are within the recommended values.
  6. Power Dissipation: Do not exceed the maximum power dissipation to prevent overheating and potential damage to the device.
  7. Operating Temperature: The device is designed to operate within the temperature range of -40°C to 85°C. Ensure that the ambient temperature does not exceed these limits.

Additional Notes:

  • Handling Precautions: The DG413 is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection when handling the device.
  • Storage Conditions: Store the device in a dry, cool place to prevent moisture damage.
  • Mounting: Ensure that the device is mounted securely to the PCB to avoid mechanical stress that could affect performance.
(For reference only)

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