Specifications
SKU: 1067101
32BIT MPU,DMA,TIMER
Parameter | Description | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (Vcc) | Operating voltage range | 4.75 | - | 5.25 | V |
Operating Temperature Range | Temperature range for operation | -40 | - | +85 | °C |
Clock Frequency (fosc) | Oscillator frequency | - | 10 | 40 | MHz |
Power Consumption | Active mode power consumption | - | 200 | - | mW |
Standby Current | Current in standby mode | - | 10 | - | μA |
I/O Voltage Levels | Input/output voltage levels | 0 | - | 5 | V |
Maximum Output Current per Pin | Maximum current per I/O pin | - | - | 25 | mA |
Maximum Total Output Current | Total output current for all pins | - | - | 100 | mA |
Storage Temperature Range | Temperature range for storage | -65 | - | +150 | °C |
ESD Rating | Electrostatic discharge tolerance | - | - | 2000 | V |
Instructions for MC68340FE25E
Power Supply:
- Ensure the supply voltage (Vcc) is within the range of 4.75V to 5.25V.
- Use a stable power supply to avoid fluctuations that can affect performance.
Clock Configuration:
- The oscillator frequency (fosc) should be set between 10 MHz and 40 MHz.
- Use a high-quality crystal or oscillator to maintain accuracy and stability.
Temperature Considerations:
- Operate the device within the temperature range of -40°C to +85°C.
- Store the device in an environment with temperatures between -65°C and +150°C.
Power Management:
- In active mode, the power consumption is typically around 200 mW.
- To reduce power consumption, use the standby mode which draws approximately 10 μA.
I/O Handling:
- Input/output voltage levels should be within 0V to 5V.
- Do not exceed the maximum output current per pin (25 mA) or the total output current (100 mA).
ESD Protection:
- Handle the device with care to avoid electrostatic discharge.
- Use proper grounding and ESD protection equipment when handling the device.
Programming and Configuration:
- Refer to the datasheet for specific programming and configuration details.
- Use appropriate development tools and software to program the device.
Mounting and PCB Design:
- Follow recommended PCB layout guidelines to ensure optimal performance.
- Use proper thermal management techniques to dissipate heat effectively.
Testing and Validation:
- Perform thorough testing under various conditions to ensure reliability.
- Validate the design against the specified parameters and operating conditions.
For detailed specifications and additional information, refer to the official datasheet and application notes provided by the manufacturer.
(For reference only)Inquiry - MC68340FE25E