Instructions for Use:

1. Power Supply Connection:

   • Connect the input voltage (VIN) to the power supply.
   • Ensure the input voltage is within the operating range (3.3 to 5.5V).
   • Connect the output voltage (VOUT) to the load.

2. Capacitor Requirements:

   • Place a 10μF ceramic capacitor between VIN and GND as close to the device as possible.
   • Place a 10μF ceramic capacitor between VOUT and GND as close to the device as possible.

3. Thermal Management:

   • Ensure adequate heat dissipation by using a heatsink or PCB with sufficient copper area.
   • The thermal resistance (θJA) is 35°C/W, so ensure the ambient temperature does not exceed the maximum operating temperature.

4. PCB Layout:

   • Use a ground plane to reduce noise and improve thermal performance.
   • Keep traces short and wide to minimize inductance and resistance.

5. ESD Protection:

   • Handle the device with ESD precautions to avoid damage.
   • Use proper grounding and ESD protection devices in the circuit.

6. Stability:

   • The device is stable with ceramic capacitors. Avoid using electrolytic capacitors without additional stability measures.

7. Storage:

   • Store the device in a dry environment to prevent moisture damage.
   • Follow the recommended storage temperature range (-65 to 150°C).

8. Testing:

   • Before final assembly, test the device with a known good load to ensure it meets the specified output voltage accuracy and current capabilities.