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Specifications
SKU: 1108257
In-System Programmable High Density PLD
| Parameter | Description | Value |
|---|---|---|
| Part Number | Full Part Number | ISPLSI1016E-80LJI |
| Package Type | Package Style | 80-Pin PQFP (Plastic Quad Flat Pack) |
| Operating Temperature Range | Temperature Range for Normal Operation | -40°C to +85°C |
| Supply Voltage (Vcc) | Recommended Operating Supply Voltage | 3.3V ± 0.3V |
| I/O Voltage (Vio) | Input/Output Voltage Range | 1.2V to 3.6V |
| Clock Frequency | Maximum Clock Frequency | 200 MHz |
| Power Consumption | Typical Power Consumption at 200 MHz | 250 mW |
| Static Current (Icc) | Quiescent Current at Vcc = 3.3V | 10 mA |
| Input Leakage Current (Iil) | Maximum Input Leakage Current per Pin | ±1 μA |
| Output Drive Current (Iol/Ioh) | Maximum Output Drive Current (Low/High) | ±24 mA / ±24 mA |
| Propagation Delay (tpd) | Maximum Propagation Delay at 200 MHz | 5 ns |
| Storage Temperature Range | Temperature Range for Storage | -65°C to +150°C |
| ESD Rating | Human Body Model (HBM) ESD Rating | 2000 V |
| Lead Finish | Surface Finish of Leads | Matte Tin |
| RoHS Compliance | Compliance with Restriction of Hazardous Substances Directive | Yes |
Instructions:
Power Supply:
- Ensure that the supply voltage (Vcc) is within the specified range of 3.3V ± 0.3V.
- Use decoupling capacitors (typically 0.1 μF and 10 μF) close to the power pins to minimize noise and provide stable operation.
Clock Input:
- Connect the clock input to a stable and clean clock source to avoid timing issues.
- Ensure the clock frequency does not exceed 200 MHz to prevent overheating and potential damage.
Input/Output Handling:
- Keep the I/O voltage (Vio) within the range of 1.2V to 3.6V to ensure proper signal levels.
- Do not exceed the maximum output drive current of ±24 mA to avoid damaging the device.
Thermal Management:
- Place the device on a PCB with adequate thermal vias and copper planes to dissipate heat effectively.
- Monitor the operating temperature to ensure it stays within the -40°C to +85°C range.
Handling and Storage:
- Handle the device with care to avoid ESD damage. Use appropriate ESD protection measures.
- Store the device in a dry environment within the storage temperature range of -65°C to +150°C.
Soldering:
- Follow the recommended soldering profile to ensure reliable connections without causing thermal stress to the device.
- Use a lead-free soldering process if required by RoHS compliance.
Testing:
- Perform initial testing under controlled conditions to verify the functionality of the device.
- Use a logic analyzer or oscilloscope to monitor signals and ensure they meet the specified timing parameters.
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