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TC74HC541AF

Specifications

SKU: 1126954

BUY TC74HC541AF https://www.utsource.net/itm/p/1126954.html
IC HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, 0.300 INCH, 1.27 MM PITCH, PLASTIC, SOP-20, Bus Driver/Transceiver
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC 2.0 6.0 V
Input Low Voltage VIL VCC = 4.5V to 5.5V 0.8 V
Input High Voltage VIH VCC = 4.5V to 5.5V 2.0 V
Output Low Voltage VOL IOL = 8 mA, VCC = 4.5V to 5.5V 0.4 V
Output High Voltage VOH IOH = -0.4 mA, VCC = 4.5V to 5.5V 2.4 V
Propagation Delay Time (Low to High) tPLH VCC = 4.5V to 5.5V, VO = 1.5V to 3.5V 12 ns
Propagation Delay Time (High to Low) tPHL VCC = 4.5V to 5.5V, VO = 1.5V to 3.5V 12 ns
Maximum Operating Frequency fMAX VCC = 4.5V to 5.5V, TA = 25°C 35 MHz
Storage Temperature Range TSTG -65 150 °C
Operating Temperature Range TA -40 85 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0V to 6.0V to avoid damage to the device.
  2. Input Voltage Levels:

    • For reliable operation, ensure that input voltages are within the specified ranges for VIL and VIH.
    • VIL should be less than or equal to 0.8V, and VIH should be greater than or equal to 2.0V when VCC is between 4.5V and 5.5V.
  3. Output Voltage Levels:

    • The output low voltage (VOL) should not exceed 0.4V when sourcing 8mA.
    • The output high voltage (VOH) should be at least 2.4V when sinking -0.4mA.
  4. Propagation Delay:

    • The propagation delay times (tPLH and tPHL) should be considered when designing timing-sensitive circuits. Both delays are typically 12ns under standard conditions.
  5. Operating Frequency:

    • The maximum operating frequency (fMAX) is 35MHz at 25°C. Ensure that the device is used within this frequency range to maintain performance.
  6. Temperature Ranges:

    • Store the device within the storage temperature range (-65°C to 150°C).
    • Operate the device within the operating temperature range (-40°C to 85°C) to ensure reliable performance.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuitry.
    • Use proper ESD protection measures when handling the device.
  8. Mounting:

    • Ensure proper mounting and soldering techniques to prevent mechanical stress and thermal issues.
    • Follow the recommended PCB layout guidelines for optimal performance and reliability.
(For reference only)

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