Share:
Specifications
SKU: 1141073
IC HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO14, 0.300 INCH, 1.27 MM PITCH, PLASTIC, SOP-14, FF/Latch
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | - | 2.0 | - | 5.5 | V |
| Input Voltage (High) | VIH | IIH = 10 μA | 3.15 | - | 5.5 | V |
| Input Voltage (Low) | VIL | IIL = -10 μA | 0 | - | 2.0 | V |
| Output Voltage (High) | VOH | IOH = -400 μA | 2.4 | - | 5.0 | V |
| Output Voltage (Low) | VOL | IOL = 8 mA | 0 | - | 0.4 | V |
| Propagation Delay Time | tpd | VCC = 5 V, TA = 25°C | - | 9 | - | ns |
| Power Dissipation | PD | Continuous, TA = 25°C | - | - | 600 | mW |
| Operating Temperature | TOP | - | -40 | - | 85 | °C |
| Storage Temperature | TSTG | - | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.0 V to 5.5 V.
- Connect the ground (GND) pin to a stable reference point.
Input Signals:
- Apply input voltages (VIH and VIL) that meet the specified thresholds to ensure proper logic levels.
- Avoid exceeding the maximum input voltage to prevent damage to the device.
Output Signals:
- The output voltage levels (VOH and VOL) should be monitored to ensure they meet the required specifications for the connected circuitry.
- Ensure the output current does not exceed the maximum ratings to avoid overheating or damage.
Propagation Delay:
- Consider the propagation delay time (tpd) when designing timing-critical circuits to ensure reliable operation.
Temperature:
- Operate the device within the specified operating temperature range (-40°C to 85°C) to ensure reliable performance.
- Store the device within the storage temperature range (-65°C to 150°C) to prevent damage.
Power Dissipation:
- Monitor the power dissipation (PD) to ensure it does not exceed the maximum continuous rating of 600 mW at 25°C ambient temperature.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow proper soldering techniques and avoid excessive heat during assembly.
Mounting:
- Ensure the device is securely mounted on the PCB to prevent mechanical stress and potential failure.
By adhering to these parameters and instructions, you can ensure the reliable and efficient operation of the TC74HC107AF.
(For reference only)Inquiry - TC74HC107AF
