Specifications
SKU: 1146939
SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE
Parameter | Symbol | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Drain-Source Voltage | V(DS) | - | - | 50 | V |
Gate-Source Voltage | V(GS) | -10 | - | 10 | V |
Drain Current | I(D) | - | 2 | 5 | A |
Gate Threshold Voltage | V(GS(th)) | 1.0 | 2.0 | 3.0 | V |
Transconductance | g(fs) | 2.0 | - | 4.0 | S |
Input Capacitance | Ciss | - | 800 | - | pF |
Output Capacitance | Coss | - | 250 | - | pF |
Reverse Transfer Capacitance | Crss | - | 100 | - | pF |
Total Power Dissipation | P(TOT) | - | - | 100 | W |
Instructions for Use:
Biasing:
- Ensure that the gate-source voltage ( V_ ) is within the specified range of -10V to +10V.
- The drain-source voltage ( V_ ) should not exceed 50V.
Current Handling:
- The maximum continuous drain current ( I_D ) is 5A, with a typical value of 2A.
- Ensure adequate heat sinking if operating at high currents to avoid exceeding the total power dissipation limit of 100W.
Gate Drive:
- Apply a gate threshold voltage ( V_{GS(th)} ) between 1.0V and 3.0V to turn on the transistor.
- For optimal performance, use a gate drive circuit that can provide a clean and stable gate voltage.
Capacitance Considerations:
- The input capacitance ( C_ ) is typically 800pF, which affects the switching speed.
- The output capacitance ( C_ ) is typically 250pF, and the reverse transfer capacitance ( C_ ) is typically 100pF. These values should be considered in high-frequency applications.
Thermal Management:
- The device has a total power dissipation limit of 100W. Ensure proper thermal management, such as using a heatsink or forced air cooling, to prevent overheating.
Storage and Handling:
- Store the device in a dry environment to prevent moisture damage.
- Handle the device with care to avoid static discharge, which can damage the sensitive gate structure.
Testing:
- When testing the device, use appropriate test equipment and follow safety guidelines to avoid damaging the device or causing injury.
Mounting:
- Ensure that the device is securely mounted to the PCB or heatsink to prevent mechanical stress and ensure good thermal contact.
Inquiry - 2SK2134