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2SK2134

Specifications

SKU: 1146939

BUY 2SK2134 https://www.utsource.net/itm/p/1146939.html
SWITCHING N-CHANNEL POWER MOS FET INDUSTRIAL USE
Parameter Symbol Min Typ Max Unit
Drain-Source Voltage V(DS) - - 50 V
Gate-Source Voltage V(GS) -10 - 10 V
Drain Current I(D) - 2 5 A
Gate Threshold Voltage V(GS(th)) 1.0 2.0 3.0 V
Transconductance g(fs) 2.0 - 4.0 S
Input Capacitance Ciss - 800 - pF
Output Capacitance Coss - 250 - pF
Reverse Transfer Capacitance Crss - 100 - pF
Total Power Dissipation P(TOT) - - 100 W

Instructions for Use:

  1. Biasing:

    • Ensure that the gate-source voltage ( V_ ) is within the specified range of -10V to +10V.
    • The drain-source voltage ( V_ ) should not exceed 50V.
  2. Current Handling:

    • The maximum continuous drain current ( I_D ) is 5A, with a typical value of 2A.
    • Ensure adequate heat sinking if operating at high currents to avoid exceeding the total power dissipation limit of 100W.
  3. Gate Drive:

    • Apply a gate threshold voltage ( V_{GS(th)} ) between 1.0V and 3.0V to turn on the transistor.
    • For optimal performance, use a gate drive circuit that can provide a clean and stable gate voltage.
  4. Capacitance Considerations:

    • The input capacitance ( C_ ) is typically 800pF, which affects the switching speed.
    • The output capacitance ( C_ ) is typically 250pF, and the reverse transfer capacitance ( C_ ) is typically 100pF. These values should be considered in high-frequency applications.
  5. Thermal Management:

    • The device has a total power dissipation limit of 100W. Ensure proper thermal management, such as using a heatsink or forced air cooling, to prevent overheating.
  6. Storage and Handling:

    • Store the device in a dry environment to prevent moisture damage.
    • Handle the device with care to avoid static discharge, which can damage the sensitive gate structure.
  7. Testing:

    • When testing the device, use appropriate test equipment and follow safety guidelines to avoid damaging the device or causing injury.
  8. Mounting:

    • Ensure that the device is securely mounted to the PCB or heatsink to prevent mechanical stress and ensure good thermal contact.
(For reference only)

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