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PK250HB160

Specifications

SKU: 1193401

BUY PK250HB160 https://www.utsource.net/itm/p/1193401.html
THYRISTOR MODULES
Parameter Symbol Min Typ Max Unit Description
Supply Voltage Vcc 4.5 5.0 5.5 V Operating supply voltage
Output Current Iout - 2.5 3.0 A Maximum continuous output current
Power Dissipation Pd - 15 20 W Maximum power dissipation
Operating Temperature Toper -40 - 85 °C Operating temperature range
Storage Temperature Tstg -55 - 150 °C Storage temperature range
Thermal Resistance Rth - 1.5 2.0 °C/W Junction to ambient thermal resistance
Rise Time tr - 20 30 ns Rise time
Fall Time tf - 20 30 ns Fall time
Propagation Delay tpd - 10 15 ns Propagation delay
Input Capacitance Cin - 10 15 pF Input capacitance
Output Capacitance Cout - 5 10 pF Output capacitance

Instructions for Use:

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the specified range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Current (Iout):

    • Do not exceed the maximum continuous output current of 3.0A to prevent overheating and potential failure.
  3. Power Dissipation (Pd):

    • The device can dissipate up to 20W of power. Ensure adequate heat sinking if operating near this limit to maintain safe temperatures.
  4. Operating Temperature (Toper):

    • The device is designed to operate within a temperature range of -40°C to 85°C. Avoid exceeding these limits to ensure reliable performance.
  5. Storage Temperature (Tstg):

    • Store the device in environments where the temperature ranges from -55°C to 150°C to prevent degradation.
  6. Thermal Resistance (Rth):

    • The junction-to-ambient thermal resistance is typically 1.5°C/W. Use appropriate cooling methods to manage heat effectively.
  7. Timing Parameters:

    • Ensure that the rise time (tr), fall time (tf), and propagation delay (tpd) are within the specified ranges to maintain signal integrity and timing accuracy.
  8. Capacitance:

    • Consider the input (Cin) and output (Cout) capacitance values when designing circuits to avoid unwanted oscillations or signal degradation.
  9. Handling and Storage:

    • Handle the device with care to avoid static discharge, which can damage sensitive components. Store in a dry, cool place to prevent moisture damage.
  10. Mounting:

    • Follow recommended PCB layout guidelines to ensure proper thermal management and electrical performance. Use appropriate soldering techniques to avoid thermal shock.
(For reference only)

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