Specifications
SKU: 1227745
PNP Silicon AF Transistors For general AF applications High current gain
Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 2.0 | - | 5.5 | V | Operating voltage range |
Input Voltage | VIN | -0.3 | - | VCC + 0.3 | V | Input voltage range |
Output Voltage | VOUT | - | VCC - 1.5 | VCC - 0.3 | V | Output voltage range |
Quiescent Current | IQ | - | 1.0 | - | μA | Current consumption when no load |
Load Current | IL | 0 | - | 150 | mA | Maximum continuous output current |
Shutdown Current | ISD | - | 0.1 | - | μA | Current consumption in shutdown mode |
Output Ripple | VRIPPLE | - | 20 | - | mV | Peak-to-peak ripple at full load |
Dropout Voltage | VDO | - | 200 | - | mV | Voltage difference between input and output at max load |
Operating Temperature | TOP | -40 | - | 85 | °C | Temperature range for normal operation |
Storage Temperature | TSTG | -65 | - | 150 | °C | Temperature range for storage |
Instructions:
Power Supply Connection:
- Connect the positive terminal of the power supply to the VCC pin.
- Connect the negative terminal of the power supply to the GND pin.
Input and Output Connections:
- Connect the input signal to the VIN pin.
- Connect the output load to the VOUT pin.
Shutdown Mode:
- To enter shutdown mode, connect the SHDN pin to GND. The device will consume minimal current (ISD).
Capacitors:
- Use a 1μF ceramic capacitor between VCC and GND for stability.
- Place a 10μF electrolytic capacitor between VOUT and GND to reduce output ripple.
Thermal Considerations:
- Ensure adequate heat dissipation if operating at high load currents or in high ambient temperatures.
- The device is designed to operate within the specified temperature range, but performance may degrade outside these limits.
Handling Precautions:
- Handle the device with care to avoid static damage.
- Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Mount the device on a PCB with proper soldering techniques to ensure reliable connections.
- Ensure that all pins are securely soldered and free from shorts or cold solder joints.
Inquiry - BCW67A