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Specifications
SKU: 1240373
N-Channel Small Signal MOSFETs 20V…800V; Package: PG-SOT223-4; Package: SOT-223; VDS max: 600.0 V; RDS on max @10V: 45,000.0 mOhm; RDS on max @4.5V: 60,000.0 mOhm; RDS on max @2.5V: -;
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Maximum Drain Voltage | VDS(max) | 1200 | V |
| Maximum Gate-Source Voltage | VGS(max) | ±20 | V |
| Maximum Drain Current (Pulsed) | ID(max) (tp=10μs, IGM) | 500 | A |
| Maximum Drain Current (Continuous) | ID(max) | 100 | A |
| Maximum Power Dissipation | PTOT(max) | 280 | W |
| Junction Temperature Range | TJ | -55 to +175 | °C |
| Storage Temperature Range | TSTG | -65 to +175 | °C |
| Thermal Resistance, Junction to Case | RθJC | 0.3 | K/W |
Instructions for Use:
Handling Precautions:
- The BSP125 is sensitive to electrostatic discharge (ESD). Handle the device with ESD precautions.
- Avoid touching the pins directly; use proper handling tools.
Mounting:
- Ensure proper heat sinking to manage thermal resistance and maintain junction temperature within specified limits.
- Use a thermal interface material (TIM) between the device and the heatsink for optimal heat dissipation.
Biasing:
- Apply gate-source voltage (VGS) carefully to avoid exceeding the maximum rating of ±20V.
- For reliable operation, keep VGS within the recommended range of 10V to 15V.
Current Limiting:
- When operating at high drain currents, ensure that the current does not exceed the pulsed or continuous ratings.
- Use appropriate current-limiting resistors if necessary to protect the device.
Power Dissipation:
- Monitor power dissipation to ensure it does not exceed the maximum rated power (280W).
- Consider derating power dissipation at higher ambient temperatures to prevent overheating.
Temperature Management:
- Operate the device within the specified junction temperature range (-55°C to +175°C).
- Store the device within the storage temperature range (-65°C to +175°C).
Testing:
- Perform initial testing at lower power levels to verify correct operation and thermal management.
- Regularly check for signs of overheating or abnormal performance during prolonged operation.
Soldering:
- Use a controlled soldering process to avoid thermal shock and mechanical stress on the device.
- Follow recommended soldering profiles provided by the manufacturer.
Documentation:
- Refer to the datasheet and application notes for detailed information and specific recommendations for your application.
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