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CS5390KP

Specifications

SKU: 1241113

BUY CS5390KP https://www.utsource.net/itm/p/1241113.html
Analog-to-Digital Converter, 20-Bit
Parameter Description Symbol Min Typ Max Unit
Supply Voltage Operating voltage range for the device VDD 2.7 - 5.5 V
Quiescent Current Current consumed by the device when no output is active IQ - 1.2 2.0 mA
Output Current Maximum current that can be sourced or sunk by each output pin IO - - 25 mA
Output Voltage Swing Range over which the output voltage can swing while driving a load VOS 0.1 - 0.4 V
Propagation Delay Time delay between input signal change and corresponding output signal change tpd - 10 20 ns
Operating Temperature Temperature range within which the device will operate reliably Toper -40 - 85 °C
Storage Temperature Temperature range within which the device can be stored without damage Tstg -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the specified range of 2.7V to 5.5V.
    • Connect the power supply to the VDD pin and ground to the GND pin.
  2. Output Configuration:

    • Each output pin can source or sink up to 25mA of current.
    • Ensure the load connected to the output pins does not exceed this limit to avoid damage.
  3. Signal Timing:

    • The propagation delay (tpd) is typically 10ns, with a maximum of 20ns.
    • Account for this delay in your timing calculations to ensure proper operation.
  4. Temperature Considerations:

    • The device is designed to operate within a temperature range of -40°C to 85°C.
    • Store the device in a temperature range of -65°C to 150°C to prevent damage.
  5. Quiescent Current:

    • The quiescent current (IQ) is typically 1.2mA and should not exceed 2.0mA.
    • This value is important for power budgeting in low-power applications.
  6. Output Voltage Swing:

    • The output voltage swing (VOS) is typically 0.1V to 0.4V from the supply rails.
    • Ensure that the load impedance is appropriate to achieve the desired output voltage levels.
  7. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and assembly.
  8. Mounting and Assembly:

    • Follow the recommended PCB layout guidelines provided in the datasheet to ensure optimal performance and reliability.
    • Use appropriate soldering techniques and temperatures to avoid thermal stress on the device.

By following these parameters and instructions, you can ensure reliable and efficient operation of the CS5390KP.

(For reference only)

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