Specifications
SKU: 1254148
Photo coupler (phototransitor output)
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Forward Voltage | VF | IF = 20 mA | 1.1 | 1.3 | 1.6 | V |
Reverse Breakdown Voltage | VR | IR = 5 μA | 5 | - | 7 | V |
Forward Current | IF | Tj = 25°C | - | 20 | 50 | mA |
Peak Pulse Current | IFP | t = 10 ms, Duty ≤ 1% | - | - | 100 | mA |
Storage Temperature | Tstg | - | -40 | - | 110 | °C |
Operating Temperature | Topr | - | -40 | - | 105 | °C |
Rise Time | tr | RL = 100 Ω, CL = 10 pF | - | 8 | - | ns |
Fall Time | tf | RL = 100 Ω, CL = 10 pF | - | 8 | - | ns |
Propagation Delay Time | tpdl | RL = 100 Ω, CL = 10 pF | - | 20 | - | ns |
Instructions for Use:
Mounting and Handling:
- Handle the device with care to avoid mechanical damage.
- Ensure proper alignment during mounting to prevent short circuits or open circuits.
Electrical Connections:
- Connect the anode (A) and cathode (K) terminals correctly to avoid reverse polarity which can lead to device failure.
- Ensure that the forward current (IF) does not exceed the maximum rating to prevent overheating and potential damage.
Thermal Management:
- Operate the device within the specified temperature range to ensure reliable performance.
- Use appropriate heat sinks if operating at high currents or in high-temperature environments.
Pulse Operation:
- For pulse operation, ensure that the peak pulse current (IFP) and duty cycle do not exceed the specified limits to avoid thermal stress.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
Testing:
- Use appropriate test equipment and follow standard testing procedures to avoid damaging the device.
- Ensure that the test conditions match the specified conditions in the parameter table for accurate results.
Soldering:
- Use a controlled soldering process to avoid excessive heat, which can damage the device.
- Follow the recommended soldering profile provided by the manufacturer.
Compliance:
- Ensure that the device is used in compliance with all relevant safety and regulatory standards.
For more detailed information, refer to the datasheet provided by the manufacturer.
(For reference only)Inquiry - TLP421F(GR)