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TLP421F(GR)

Specifications

SKU: 1254148

BUY TLP421F(GR) https://www.utsource.net/itm/p/1254148.html
Photo coupler (phototransitor output)
Parameter Symbol Conditions Min Typ Max Unit
Forward Voltage VF IF = 20 mA 1.1 1.3 1.6 V
Reverse Breakdown Voltage VR IR = 5 μA 5 - 7 V
Forward Current IF Tj = 25°C - 20 50 mA
Peak Pulse Current IFP t = 10 ms, Duty ≤ 1% - - 100 mA
Storage Temperature Tstg - -40 - 110 °C
Operating Temperature Topr - -40 - 105 °C
Rise Time tr RL = 100 Ω, CL = 10 pF - 8 - ns
Fall Time tf RL = 100 Ω, CL = 10 pF - 8 - ns
Propagation Delay Time tpdl RL = 100 Ω, CL = 10 pF - 20 - ns

Instructions for Use:

  1. Mounting and Handling:

    • Handle the device with care to avoid mechanical damage.
    • Ensure proper alignment during mounting to prevent short circuits or open circuits.
  2. Electrical Connections:

    • Connect the anode (A) and cathode (K) terminals correctly to avoid reverse polarity which can lead to device failure.
    • Ensure that the forward current (IF) does not exceed the maximum rating to prevent overheating and potential damage.
  3. Thermal Management:

    • Operate the device within the specified temperature range to ensure reliable performance.
    • Use appropriate heat sinks if operating at high currents or in high-temperature environments.
  4. Pulse Operation:

    • For pulse operation, ensure that the peak pulse current (IFP) and duty cycle do not exceed the specified limits to avoid thermal stress.
  5. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
  6. Testing:

    • Use appropriate test equipment and follow standard testing procedures to avoid damaging the device.
    • Ensure that the test conditions match the specified conditions in the parameter table for accurate results.
  7. Soldering:

    • Use a controlled soldering process to avoid excessive heat, which can damage the device.
    • Follow the recommended soldering profile provided by the manufacturer.
  8. Compliance:

    • Ensure that the device is used in compliance with all relevant safety and regulatory standards.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)

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