Share:


HIP6019BCB-T

Specifications

SKU: 1283094

BUY HIP6019BCB-T https://www.utsource.net/itm/p/1283094.html
Voltage-Mode SMPS Controller
Parameter Description Min Typ Max Unit
Input Voltage (VIN) Operating input voltage range 4.5 - 18 V
Output Voltage (VOUT) Adjustable output voltage range 0.8 - 17.5 V
Output Current (IOUT) Continuous output current - 3 4 A
Switching Frequency (fSW) Fixed switching frequency - 600 - kHz
Efficiency (η) Typical efficiency at full load - 92 - %
Quiescent Current (IQ) Quiescent current - 2.5 - mA
Shutdown Current (ISD) Shutdown mode current - 1 - μA
Thermal Shutdown (TSD) Thermal shutdown temperature - - 160 °C
Package Type of package - - - SOIC-8

Instructions for Using HIP6019BCB-T

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 4.5V to 18V.
    • Use appropriate decoupling capacitors (e.g., 10μF ceramic) close to the VIN pin to reduce noise and stabilize the input.
  2. Output Voltage (VOUT):

    • Set the output voltage using external resistors R1 and R2 according to the formula: ( V_ = 0.8 times (1 + frac) ).
    • Ensure the output voltage is within the range of 0.8V to 17.5V.
  3. Output Current (IOUT):

    • The device can provide up to 4A of continuous output current.
    • For higher current applications, ensure adequate heat dissipation and use a heatsink if necessary.
  4. Switching Frequency (fSW):

    • The fixed switching frequency is 600kHz.
    • This helps in reducing the size of external components like inductors and capacitors.
  5. Efficiency (η):

    • The typical efficiency at full load is 92%.
    • Optimize the design by selecting low ESR (Equivalent Series Resistance) capacitors and inductors to maximize efficiency.
  6. Quiescent Current (IQ):

    • The quiescent current is typically 2.5mA.
    • This is the current consumed by the IC when it is active but not driving any load.
  7. Shutdown Current (ISD):

    • The shutdown mode current is typically 1μA.
    • Use the SHDN pin to control the shutdown mode. Pulling the SHDN pin low will put the device into shutdown mode.
  8. Thermal Shutdown (TSD):

    • The device will automatically shut down if the temperature exceeds 160°C.
    • Ensure proper thermal management to prevent overheating.
  9. Package:

    • The HIP6019BCB-T is available in an SOIC-8 package.
    • Follow standard PCB layout guidelines to ensure reliable operation and thermal performance.
  10. Layout Considerations:

    • Place the input and output capacitors as close as possible to the respective pins.
    • Use wide traces for power and ground connections to minimize resistance and inductance.
    • Keep the loop area of the high-frequency currents small to reduce electromagnetic interference (EMI).
  11. Application Circuit:

    • Refer to the datasheet for a typical application circuit and component values.
    • Verify the stability of the circuit with the selected components and operating conditions.

By following these instructions, you can ensure optimal performance and reliability of the HIP6019BCB-T in your design.

(For reference only)

 Inquiry - HIP6019BCB-T