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HCF4047BF

Specifications

SKU: 1371354

BUY HCF4047BF https://www.utsource.net/itm/p/1371354.html
Monostable Multivibrator
Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 3 - 15 V Operating supply voltage range
Output Current IO - 2.5 16 mA Maximum output current per output pin
Input Current II - 1 10 μA Maximum input current per input pin
Propagation Delay Time tpd - 100 300 ns Typical propagation delay time at VCC = 5V
Power Dissipation PTOT - - 500 mW Total power dissipation
Operating Temperature Range TA -40 - 85 °C Ambient temperature range
Storage Temperature Range TSTG -65 - 150 °C Temperature range for storage
Maximum Junction Temperature TJ(max) - - 150 °C Maximum junction temperature

Instructions for Using HCF4047BF

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the range of 3V to 15V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Input Signals:

    • Apply input signals to the appropriate input pins.
    • Ensure that the input current does not exceed 10 μA to avoid damaging the device.
  3. Output Loads:

    • Connect the load to the output pins.
    • Ensure that the output current does not exceed 16 mA to prevent damage to the output transistors.
  4. Propagation Delay:

    • Consider the typical propagation delay time of 100 ns to 300 ns when designing your circuit to ensure proper timing.
  5. Thermal Management:

    • Keep the ambient temperature within the operating range of -40°C to 85°C.
    • Ensure adequate heat dissipation to keep the junction temperature below 150°C.
  6. Storage:

    • Store the device in a temperature-controlled environment between -65°C and 150°C to prevent damage.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the sensitive components.
    • Use proper ESD protection measures during handling and installation.
  8. Testing:

    • Test the device under the specified operating conditions to ensure it meets the required performance parameters.
  9. Mounting:

    • Mount the device on a suitable PCB with appropriate soldering techniques to ensure reliable connections.
(For reference only)

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